<html><body><div style="font-family: arial,helvetica,sans-serif; font-size: 11pt; color: #000000"><div>Hi <!--StartFragment-->Ningzhi<!--EndFragment--> <br></div><div>We dice sapphire wafer at Poly using a resinoid blade, grit size of 45 microns minimum (sometime 75 microns), cutting speed lower than your at 0.4 mm/s, spindle speed at 22 KRPM and we don't have issue.<br data-mce-bogus="1"></div><div>Sample thickness is the same as yours, and we cut it in one pass.<br data-mce-bogus="1"></div><div><br data-mce-bogus="1"></div><div>Hope this help<br data-mce-bogus="1"></div><div>Best<br data-mce-bogus="1"></div><div>Chris<br data-mce-bogus="1"></div><div><br></div><div data-marker="__SIG_PRE__">
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<p class="MsoNormal"><b><i><span style="font-size:12pt;font-family:'arial' , sans-serif;color:#1f497d">Christophe Clément</span></i></b></p>
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</span><span style="font-size:10pt;font-family:'wingdings';color:#1f497d">8</span><span style="font-size:8pt;font-family:'arial' , sans-serif;color:#333333"> </span><a href="mailto:christophe.clement@polymtl.ca" target="_blank" rel="nofollow noopener noreferrer"><span style="font-size:8pt;font-family:'arial' , sans-serif;color:blue">christophe.clement@polymtl.ca</span></a><br data-mce-bogus="1"></p>
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</div><div><br></div><hr id="zwchr" data-marker="__DIVIDER__"><div data-marker="__HEADERS__"><b>De: </b>"Ningzhi Xie" <nzxie@uw.edu><br><b>À: </b>labnetwork@mtl.mit.edu<br><b>Envoyé: </b>Vendredi 14 Juillet 2023 19:08:20<br><b>Objet: </b>[labnetwork] Dicing sapphire wafer<br></div><div><br><style>
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</style></div><div data-marker="__QUOTED_TEXT__"><div dir="ltr">Dear College,<br><div>I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice a 460μm sapphire (Al2O3) wafer. It seems the wafer is too hard that I get into trouble of frequently breaking the dicing blade. I have tried lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into half of the wafer (230μm) but still got the blade broken. I am wondering if you have any good suggestions on sapphire wafer dicing.</div><br><div>Thank you very much.</div><div><br clear="all"><div><div dir="ltr" class="gmail_signature"><div dir="ltr">Best regards,<div>Ningzhi Xie</div><div>Department of Electrical and Computer Engineering</div><div>University of Washington</div></div></div></div></div></div>
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