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<p class="MsoNormal">Hi Ningzhi,<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">We dice sapphire quite a bit. Our dicing owner had the following comments (we have an ADT 7122):<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal" style="margin-left:.5in">We have had good luck dicing sapphire with the following recipe:<o:p></o:p></p>
<p class="MsoNormal" style="margin-left:.5in">Feed rate = 1mm/sec<o:p></o:p></p>
<p class="MsoNormal" style="margin-left:.5in">Spindle Speed = 18krpm<o:p></o:p></p>
<p class="MsoNormal" style="margin-left:.5in">Cut depth = 200um/pass.<o:p></o:p></p>
<p class="MsoNormal" style="margin-left:.5in">I have not had great luck with Disco resin blades for dicing sapphire. We typically use ADT or Asahi resin blades.<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal" style="margin-left:.5in">A couple questions: <o:p></o:p></p>
<p class="MsoNormal" style="margin-left:.5in">What is the OD of the blade?<o:p></o:p></p>
<p class="MsoNormal" style="margin-left:.5in">Is the spray water positioned correctly on the blade as it is cutting? (not enough cooling, too much heat = increased blade load and wear)<o:p></o:p></p>
<p class="MsoNormal" style="margin-left:.5in">Is the substrate round or rectangular? Substrate diameter/dimensions?<o:p></o:p></p>
<p class="MsoNormal" style="margin-left:.5in">How far outside the substate edge does the blade begin the cutting process? (typical is 10mm)<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">-Dave<o:p></o:p></p>
<p class="MsoNormal" style="mso-margin-top-alt:auto;mso-margin-bottom-alt:auto;line-height:11.25pt;background:white">
<b><span style="font-size:9.0pt;font-family:"Arial",sans-serif;color:#BA0C2F;background:white">Dave Hollingshead</span></b><span style="font-size:9.0pt;font-family:"Arial",sans-serif;color:#3F4443"><br>
Manager, Research Operations<br>
<br>
</span><b><span style="font-size:9.0pt;font-family:"Arial",sans-serif;color:#BA0C2F">The Ohio State University</span></b><span style="font-size:9.0pt;font-family:"Arial",sans-serif;color:#3F4443"><br>
Nanotech West Labs<br>
Suite 100, 1381 Kinnear Rd, Columbus, OH 43212<br>
614.292.1355 Office<br>
<span style="background:white"><a href="mailto:hollingshead.19@osu.edu"><span style="color:#0563C1">hollingshead.19@osu.edu</span></a></span> /
<a href="http://nanotech.osu.edu"><span style="color:#BA0C2F;background:white">nanotech.osu.edu</span></a><br>
<br>
Pronouns: he/him/his<o:p></o:p></span></p>
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<p class="MsoNormal"><b>From:</b> labnetwork <labnetwork-bounces@mtl.mit.edu> <b>
On Behalf Of </b>Vahid R. Adineh<br>
<b>Sent:</b> Sunday, July 16, 2023 20:52<br>
<b>To:</b> Ningzhi Xie <nzxie@uw.edu><br>
<b>Cc:</b> labnetwork@mtl.mit.edu<br>
<b>Subject:</b> Re: [labnetwork] Dicing sapphire wafer<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal" style="mso-line-height-alt:.75pt"><span style="font-size:1.0pt;color:white">Dear Ningzhi, Regarding your inquiry about sapphire cutting, our current practice involves setting a depth of <0. 2mm per cut (e. g. , 3-pass cuts for a 0. 5mm
thickness sapphire wafer) with a spindle revolution of 15K and a cutting speed of
<o:p></o:p></span></p>
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<p class="MsoNormal">Dear Ningzhi,<br>
<br>
Regarding your inquiry about sapphire cutting, our current practice involves setting a depth of <0.2mm per cut (e.g., 3-pass cuts for a 0.5mm thickness sapphire wafer) with a spindle revolution of 15K and a cutting speed of 1 mm/s. To minimise blade vibrations,
we utilise blades with smaller outer diameters, specifically the P1A851 SDC320R10MB01 (52x0.3x40) for sapphire wafers.<br>
<br>
We are currently equipped with the DAD3350, which incorporates automatic blade dressing. However, in the past, when using the DAD321, we were performing manual blade dressing after every 5 cuts. This involved unloading the sapphire wafer after 5 cuts, performing
the blade dressing on a dressing board installed on a separate tape, reloading the sapphire wafer, and then resuming the dicing process.<br>
<br>
I hope this information proves helpful to you.<br>
<br>
Thank you,<br>
Vahid<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">On Sat, Jul 15, 2023 at 10:42 PM Deng, Jiangdong <<a href="mailto:jdeng@cns.fas.harvard.edu">jdeng@cns.fas.harvard.edu</a>> wrote:<o:p></o:p></p>
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<p class="MsoNormal">1mm/s is too fast for sapphire. Typically we use 0.1 or 0.2 mm/s and 20k RPM. Blade thickness should be 0.3 mm ( no thinner than 0.2 mm). Please also check the disco service, and they usually will give you very good suggestions.
<br>
<br>
-JD @ CNS of Harvard <br>
<br>
Sent from my iPhone<br>
<br>
> On Jul 14, 2023, at 7:55 PM, Ningzhi Xie <<a href="mailto:nzxie@uw.edu" target="_blank">nzxie@uw.edu</a>> wrote:<br>
> <br>
> <br>
> Dear College,<br>
> <br>
> I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice a 460μm sapphire (Al2O3) wafer. It seems the wafer is too hard that I get into trouble of frequently breaking the dicing blade. I have tried lowing the spin speed to 12000rpm, the
cutting speed to 1mm/s, and only cut into half of the wafer (230μm) but still got the blade broken. I am wondering if you have any good suggestions on sapphire wafer dicing.<br>
> <br>
> Thank you very much.<br>
> <br>
> Best regards,<br>
> Ningzhi Xie<br>
> Department of Electrical and Computer Engineering<br>
> University of Washington<br>
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