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<p class="MsoNormal"><span style="color:#1F497D">Hi,<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D">We have a circa 20 year old Karl Suss anodic bonder, which can also do fusion bonding. Generally works well, doesn’t have any alignment capability but has some tooling so you can align in a Karl Suss mask aligner
then transfer to the bonder.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D">If I could improve it I would make it easier for doing stacks of three wafers – this is an option for Karl Suss but expensive – we can sort of get round it with conducting copper tape.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D">Support has been OK but seems to need something almost every time it is used! Over the ast year has probably been used 20 times and just on the one project.<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D">Cheers<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D"><o:p> </o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D">Peter<o:p></o:p></span></p>
<p class="MsoNormal"><span style="color:#1F497D"><o:p> </o:p></span></p>
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<p class="MsoNormal"><b><span lang="EN-US">From:</span></b><span lang="EN-US"> labnetwork <labnetwork-bounces@mtl.mit.edu>
<b>On Behalf Of </b>Macdonald, Robert (GE Aerospace, US)<br>
<b>Sent:</b> 01 September 2023 19:24<br>
<b>To:</b> labnetwork@mtl.mit.edu<br>
<b>Subject:</b> [labnetwork] Your favorite wafer bonder<o:p></o:p></span></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal"><span lang="EN-US">Wafer bonding has advanced a great deal in the last twenty years. Industrial tools have incorporated many improvements in wafer handing and process capabilities.<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US"><o:p> </o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">But many of the bonders I encounter in University labs have not incorporated all those improvements.<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US"><o:p> </o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">I am wondering: What wafer bonder are you using in your facility? What vintage is it? How much use does it get? What types of bonds are you supporting (anodic, fusion, frit, polymer, etc)? What improvements to these tools
would you like to see?<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US"><o:p> </o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">Thanks,<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US"><o:p> </o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">Rob<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US"><o:p> </o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">Robert MacDonald<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">MEMS Engineer<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">GE Research<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">1 Research Circle<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">Niskayuna, NY 12309<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US">518 312-5646<o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US"><a href="mailto:Robert.macdonald@ge.com">Robert.macdonald@ge.com</a><o:p></o:p></span></p>
<p class="MsoNormal"><span lang="EN-US"><o:p> </o:p></span></p>
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