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<p class="MsoNormal">Hi Sam and Emma,<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Sam, thanks for sharing that site, that’s a great resource! Much faster and easier than hunting for every possibility in the online CRC handbook table.<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
<p class="MsoNormal">Emma, one other thing that occurred to me: I think you may also want to look at the solubility of the potential compounds. IPA will (obviously) work to dissolve anything soluble in IPA, and more generally provide a wet surface to help the
 wipe mechanically remove particles or residue, but some compounds are not IPA soluble. For some I looked up, DI H2O may be more appropriate (i.e. not very soluble in alcohol, extremely soluble in water). If you have known contaminant like that, it might make
 sense to first do DI H2O on a wipe, then IPA. Would be curious to hear from other folks what they do there or think of that. For some other compounds, it might be a bad idea to have water present, I’m not sure.<o:p></o:p></p>
<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal" style="background:white"><span style="color:black;border:none windowtext 1.0pt;padding:0in">Thanks,<o:p></o:p></span></p>
<p class="MsoNormal" style="background:white"><span style="color:black;border:none windowtext 1.0pt;padding:0in">Justin<o:p></o:p></span></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal"><b>From:</b> Sam Azadi <azadi@seas.upenn.edu> <br>
<b>Sent:</b> Wednesday, May 15, 2024 10:22 AM<br>
<b>To:</b> Wirth, Justin C <jcwirth@purdue.edu><br>
<b>Cc:</b> Emma Anquillare <eanquillare@gc.cuny.edu>; labnetwork@mtl.mit.edu<br>
<b>Subject:</b> Re: [labnetwork] Predicting Solid Etch Products<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<span style="font-size:9.0pt;font-family:wf_segoe-ui_normal;color:#212121">You don't often get email from
<a href="mailto:azadi@seas.upenn.edu">azadi@seas.upenn.edu</a>. <a href="https://aka.ms/LearnAboutSenderIdentification">
Learn why this is important</a><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:10.0pt;font-family:"Verdana",sans-serif;color:black">----
<b>External Email</b>: Use caution with attachments, links, or sharing data ----<o:p></o:p></span></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">Hi Emma, <o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">To see what compounds I may have in the chamber, I use the "compounds" section of this link: <a href="https://ptable.com/#Compounds">https://ptable.com/#Compounds</a><o:p></o:p></p>
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<p class="MsoNormal">You can just drag and drop the primary elements in the box in the middle, and on the left you'll see a list of all possible and known compounds that have the selected elements. You can start by looking at the boiling point of the ones that
 may exist inside the chamber, and as Justin said, as a rule of thumb consider the ones with Tbp < 185 C as volatile.<o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">SA <o:p></o:p></p>
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<p class="MsoNormal"><o:p> </o:p></p>
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<p class="MsoNormal">On Wed, May 15, 2024 at 7:53 AM Wirth, Justin C <<a href="mailto:jcwirth@purdue.edu">jcwirth@purdue.edu</a>> wrote:<o:p></o:p></p>
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<p class="MsoNormal" style="mso-margin-top-alt:auto;mso-margin-bottom-alt:auto">Hi Emma,<o:p></o:p></p>
<p class="MsoNormal" style="mso-margin-top-alt:auto;mso-margin-bottom-alt:auto"> <o:p></o:p></p>
<p class="MsoNormal" style="mso-margin-top-alt:auto;mso-margin-bottom-alt:auto">This is a very good question, and one that I’ve struggled to answer as well. I’m not an etch expert but by necessity have had to try to answer some of these questions, and
<a href="https://urldefense.com/v3/__https://purdue.atlassian.net/wiki/spaces/BNCWiki/pages/6246876/Tutorial*on*Etching*TutorialonEtching-GeneralMaterials-Willitetch*3F__;KysjJQ!!IBzWLUs!TANTwddpDwOfbj22F_YUpJEtqvljiVHzw7Z1iLBNvvrYiTz08eoNY0T9ifutauC6eyGzMMW23dZa00RKLcLjUQ$" target="_blank">
this</a> (reproduced below, not sure if it will come through or not) is a very rough starting point I’ve come up with that I think (hope) helps get in the ballpark. Would love to hear from other folks as to how they approach this.<o:p></o:p></p>
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Materials can generally be etched in the RIEs as long as they form volatile byproducts, or products for which the vapor pressure (at the temperature of the etch) is higher than the pressure of the chamber.<o:p></o:p></p>
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<b> </b><o:p></o:p></p>
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<b>Etching is very complicated and this will be massive oversimplification</b>...but generally volatile byproducts can be determined from literature, or as a fallback, the CRC Handbook of Chemistry and Physics Online, (4) Properties of the Elements & Inorganics,
 Physical Constants of Inorganic Compounds: <a href="https://urldefense.com/v3/__https://hbcp.chemnetbase.com/faces/documents/04_02/04_02_0001.xhtml__;!!IBzWLUs!TANTwddpDwOfbj22F_YUpJEtqvljiVHzw7Z1iLBNvvrYiTz08eoNY0T9ifutauC6eyGzMMW23dZa00S9rICseA$" target="_blank">https://hbcp.chemnetbase.com/faces/documents/04_02/04_02_0001.xhtml</a>.
 From there, click "Go to Interactive Table", and find products that may be formed (i.e. chloride, fluorides, oxides, depending on the gasses). A compound is deemed volatile if it has a boiling point at a reasonable temperature range for the temperature and
 pressure of the system. Note that at lower pressures, boiling points decrease, so these are just a good starting point reference.<o:p></o:p></p>
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 <o:p></o:p></p>
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As a VERY general rule of thumb, anything with a boiling point (t<sub>bp</sub>) < 185 C will be volatile in the ICP RIEs.<o:p></o:p></p>
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 <o:p></o:p></p>
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As an example, aluminum chloride is volatile, and aluminum fluoride and aluminum are not.<o:p></o:p></p>
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Neither Copper chloride or copper fluoride is volatile, which is why it is not allowed in any chamber:<o:p></o:p></p>
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Byproducts of silicon are very volatile:<o:p></o:p></p>
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Many times different fluorides/chlorides of the same material will have drastically different boiling points. It's important to research which will be formed in the plasma. Titanium is a good example of this, with TiCl<sub>2</sub>  and TiCl<sub>3</sub> being
 non-volatile, and TiCl4 being volatile:<o:p></o:p></p>
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<span style="color:black;border:none windowtext 1.0pt;padding:0in">Thanks,</span><o:p></o:p></p>
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<span style="color:black;border:none windowtext 1.0pt;padding:0in">Justin</span><o:p></o:p></p>
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<span style="color:black;border:none windowtext 1.0pt;padding:0in"> </span><o:p></o:p></p>
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<span style="color:black;border:none windowtext 1.0pt;padding:0in">Justin C. Wirth, PhD </span><o:p></o:p></p>
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<span style="color:black;border:none windowtext 1.0pt;padding:0in">Senior Research Engineer – EBL Processes & Nanofab Process Consultation </span><o:p></o:p></p>
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<span style="color:black;border:none windowtext 1.0pt;padding:0in">Birck Nanotechnology Center | Room 2287A<br>
765.494.8203 | </span><span style="color:black"><a href="mailto:jcwirth@purdue.edu" target="_blank"><span style="color:#0563C1;border:none windowtext 1.0pt;padding:0in">jcwirth@purdue.edu</span></a><span style="border:none windowtext 1.0pt;padding:0in"> </span></span><o:p></o:p></p>
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<span style="color:#0563C1">Purdue iLab</span></a> | <a href="https://urldefense.com/v3/__https://outlook.office.com/bookwithme/user/5ad94572a9c04a4e8aa9159479128868@purdue.edu?anonymous&ep=plink__;!!IBzWLUs!TANTwddpDwOfbj22F_YUpJEtqvljiVHzw7Z1iLBNvvrYiTz08eoNY0T9ifutauC6eyGzMMW23dZa00Tyx7nbGQ$" target="_blank">
<span style="color:#0563C1">Book time on my calendar</span></a></span><o:p></o:p></p>
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<p class="MsoNormal" style="mso-margin-top-alt:auto;mso-margin-bottom-alt:auto"><b>From:</b> labnetwork <<a href="mailto:labnetwork-bounces@mtl.mit.edu" target="_blank">labnetwork-bounces@mtl.mit.edu</a>>
<b>On Behalf Of </b>Emma Anquillare<br>
<b>Sent:</b> Friday, May 10, 2024 12:07 PM<br>
<b>To:</b> <a href="mailto:labnetwork@mtl.mit.edu" target="_blank">labnetwork@mtl.mit.edu</a><br>
<b>Subject:</b> [labnetwork] Predicting Solid Etch Products<o:p></o:p></p>
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<span style="font-size:9.0pt;font-family:wf_segoe-ui_normal;color:#212121">You don't often get email from
<a href="mailto:eanquillare@gc.cuny.edu" target="_blank">eanquillare@gc.cuny.edu</a>.
<a href="https://urldefense.com/v3/__https://aka.ms/LearnAboutSenderIdentification__;!!IBzWLUs!TANTwddpDwOfbj22F_YUpJEtqvljiVHzw7Z1iLBNvvrYiTz08eoNY0T9ifutauC6eyGzMMW23dZa00RjgrJ9kQ$" target="_blank">
Learn why this is important</a></span><o:p></o:p></p>
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<b>External Email</b>: Use caution with attachments, links, or sharing data ----</span><o:p></o:p></p>
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<p class="m3467678826546879052elementtoproof"><span style="font-size:12.0pt;font-family:Aptos;color:black">Dear Lab network,</span><o:p></o:p></p>
<p><span style="font-size:12.0pt;font-family:Aptos;color:black"> </span><o:p></o:p></p>
<p class="m3467678826546879052elementtoproof"><span style="font-size:12.0pt;font-family:Aptos;color:black">First time caller here
</span><span style="font-size:12.0pt;font-family:"Segoe UI Emoji",sans-serif;color:black">😊</span><span style="font-size:12.0pt;font-family:"Segoe UI Emoji",sans-serif;color:black"> </span><o:p></o:p></p>
<p class="m3467678826546879052elementtoproof"> <o:p></o:p></p>
<p class="m3467678826546879052elementtoproof"><span style="font-size:12.0pt;font-family:Aptos;color:black">I am new to plasma etching, and working to institute better process control in our ICP and RIE etchers in an academic shared use facility. We don’t have
 the capacity to designate a single etcher for each process, so between our three tools, we essentially have a most-restricted, somewhat restricted, and “dirty” tool. To avoid cross contamination and chamber residue buildup, we have a technician manually scrub
 out the chambers with IPA every week- usually seeing the most solid residue in our ICP that handles Lithium Niobate milling.</span><o:p></o:p></p>
<p class="m3467678826546879052elementtoproof"> <o:p></o:p></p>
<p class="m3467678826546879052elementtoproof"><span style="font-size:12.0pt;font-family:Aptos;color:black">My question is- while many products of etch reactions get pumped away as vapors, what about the reactions that do leave solid residues? Is there a systematic
 way to predict or look up what solids will be left from common (or unusual) reactions, and know how they will react and interact with other solids and gasses present in your chamber? Especially with such frequent manual cleaning, how do you ensure that you
 don’t inadvertently open the chamber to something acutely toxic, pyrophoric, shock sensitive, etc?</span><o:p></o:p></p>
<p><span style="font-size:12.0pt;font-family:Aptos;color:black"> </span><o:p></o:p></p>
<p class="m3467678826546879052elementtoproof"><span style="font-size:12.0pt;font-family:Aptos;color:black">Very curious to learn what steps people take and tools they use (literature? calculations? databases? forums?)  when approaching this problem, and when
 asked to allow a new material into a tool.</span><o:p></o:p></p>
<p class="m3467678826546879052elementtoproof"> <o:p></o:p></p>
<p><span style="font-size:12.0pt;font-family:Aptos;color:black">Best,</span><o:p></o:p></p>
<p><span style="font-size:12.0pt;font-family:Aptos;color:black">Emma</span><o:p></o:p></p>
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<p class="MsoNormal" style="mso-margin-top-alt:auto;mso-margin-bottom-alt:auto"><b><span style="font-size:12.0pt;font-family:Aptos;color:black">Emma Anquillare, PhD</span></b><o:p></o:p></p>
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<p class="MsoNormal" style="mso-margin-top-alt:auto;mso-margin-bottom-alt:auto"><span style="font-size:12.0pt;font-family:Aptos;color:black">Research Scientist</span><o:p></o:p></p>
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<span style="background:white">Nanofabrication Facility</span></span><o:p></o:p></p>
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<p class="MsoNormal" style="mso-margin-top-alt:auto;mso-margin-bottom-alt:auto"><i><span style="font-size:12.0pt;font-family:Aptos;color:black">Catalyzing Change, Celebrating Gains: </span></i><o:p></o:p></p>
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<p class="MsoNormal" style="mso-margin-top-alt:auto;mso-margin-bottom-alt:auto"><i><span style="font-size:12.0pt;font-family:Aptos;color:black">A decade of visionary science for the public good.</span></i><o:p></o:p></p>
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<p class="MsoNormal">_______________________________________________<br>
labnetwork mailing list<br>
<a href="mailto:labnetwork@mtl.mit.edu" target="_blank">labnetwork@mtl.mit.edu</a><br>
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<p class="MsoNormal"><span style="font-size:9.5pt;color:#888888">Mohsen (Sam) Azadi</span><span style="color:#888888"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:9.5pt;color:#888888">Principal Scientist</span><span style="color:#888888"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:9.5pt;color:#888888">Quattrone Nanofabrication Facility</span><span style="color:#888888"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="font-size:9.5pt;color:#888888">Singh Center for Nanotechnology</span><span style="color:#888888"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="color:#888888">University of Pennsylvania<o:p></o:p></span></p>
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<p class="MsoNormal"><span style="color:#888888">3205 Walnut St. </span><span style="font-size:9.5pt;color:#888888">Room 116</span><span style="color:#888888"><o:p></o:p></span></p>
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<p class="MsoNormal"><span style="color:#888888">Philadelphia, PA 19104<o:p></o:p></span></p>
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<p class="MsoNormal">Pronouns: he/him/his<o:p></o:p></p>
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