<div dir="ltr"><div class="gmail_default" style="font-family:arial,sans-serif">Hi Mario,</div><div class="gmail_default" style="font-family:arial,sans-serif"><br></div><div class="gmail_default" style="font-family:arial,sans-serif">We have a TPT HB16 here at UofA's nanoFAB. It is our first (and only) wirebonder in the lab, bought in 2020, and we are quite happy with it. Support from CWI Technical Sales (North America rep.) has been very good and helpful, and it was required mostly for process issues as we learned how to optimize parameters. I don't remember any major issues that would have caused significant downtime or required a service visit in these 4 years.</div><div class="gmail_default" style="font-family:arial,sans-serif"><br></div><div class="gmail_default" style="font-family:arial,sans-serif">The bonding process, once good parameters are found, works very consistently. It has required minimal maintenance, mostly replacing wire spools and bonding tips. It has an automatic and a semi-automatic mode for bonding, but I'd call both semi-automatic to some extent. The stage only moves the sample automatically in one direction, meaning that moving between bonds is still done manually in either case. But this is OK in most cases, since sample orientation typically needs adjustment between bonds at least for the use cases we've had so far. And their height sensing is very robust, making it easy to bond dies on packages with different heights.</div><div class="gmail_default" style="font-family:arial,sans-serif"><br></div><div class="gmail_default" style="font-family:arial,sans-serif">The only thing I would warn anyone about is regarding their wedge bonding tip. They made it such that the wire feeds from the top, which allows for smaller clearances around packaging sides, but also adds a bit of tension on the wire being fed under the tip (45° forward for ours). This tension will cause the wire to snap off of the tip every once in a while, depending on bonding parameters. At the beginning it would happen often enough that we decided to train the users on how to feed the wire back in place, otherwise I would be called multiple times a day to assist with that. This is not a bad solution, the procedure is not too complicated and poses almost no risk for the equipment, and we still show this to all users working with wedge bonding. However, as we learned more about wire bonding and got better at finding good parameters, this issue happens less often.</div><div class="gmail_default" style="font-family:arial,sans-serif"><br></div><div class="gmail_default" style="font-family:arial,sans-serif">We don't have much experience with other wire bonders, but at least based on our users' feedback I would recommend the TPT HB16 if it ticks most if not all of the boxes in your list of requirements.</div><div class="gmail_default" style="font-family:arial,sans-serif"><br></div><div class="gmail_default" style="font-family:arial,sans-serif">Cheers,</div><div class="gmail_default" style="font-family:arial,sans-serif">--<br>Gustavo de Oliveira Luiz, PhD<br>Applications/Research Specialist<br>nanoFAB, University of Alberta<br>+1 (780) 619-1463</div></div><br><div class="gmail_quote"><div dir="ltr" class="gmail_attr">On Tue, Nov 26, 2024 at 5:38 PM Beaudoin, Mario <<a href="mailto:beaudoin@physics.ubc.ca" target="_blank">beaudoin@physics.ubc.ca</a>> wrote:<br></div><blockquote class="gmail_quote" style="margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padding-left:1ex"><u></u>
<div>
<p>Dear Network,</p>
<p>I'm interested in potentially getting a TPT HB16 semi-automatic
wirebonder. Anyone has any experience with such bonders? Would
you recommend? Anyone has any experience with other brands, such
as Westbond 4KE/4KEH bonders?</p>
<p>Regards,<br>
</p>
<p>Mario<br>
</p>
<h2 style="font-size:1.5rem;text-align:left"><br>
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<img src="cid:ii_1936e32eef9e557f5d81" border="0"></div>
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