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<div>I’ve run NiFe on AJA Orion tool. No backing plate. 1/4” thick with no copper screen. AJA has a dummy replacement for the center magnet in the magnetron head to be used with magnetic targets. This compensates for the magnetic field of the target. </div>
<div>As another said, if the target is too thick, you could be shorting to the outer assembly. Check with a multi meter.</div>
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<div>If you have RF substrate cleaning, use that plasma as a helper plasma to strike. </div>
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<div>Angstrom engineers are really good. I would definitely talk to them about it. They should be able to point you in the correct direction.</div>
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<div>-Michael.</div>
<div>Tulane TINI</div>
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<div id="divRplyFwdMsg" dir="ltr"><font face="Calibri, sans-serif" style="font-size:11pt" color="#000000"><b>From:</b> labnetwork <labnetwork-bounces@mtl.mit.edu> on behalf of Philipp Altpeter <philipp.altpeter@lmu.de><br>
<b>Sent:</b> Tuesday, October 14, 2025 5:07 PM<br>
<b>To:</b> Mohammad Mohtasim Hamid Pial <mpial001@fiu.edu><br>
<b>Cc:</b> labnetwork@mtl.mit.edu <labnetwork@mtl.mit.edu><br>
<b>Subject:</b> Re: [labnetwork] Issue Striking Plasma for NiFe Sputtering on Angstrom Nexdep PVD System – Need Guidance</font>
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<div><span dir="ltr" style="margin-top:0; margin-bottom:0">Hello Pial,</span> <br>
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<span dir="ltr" style="margin-top:0; margin-bottom:0">Sounds like a problem of the thickness of the target. Typically a cylindrical shield surrounds the target and must be electrically isolated from it. Make sure the cylinder does not contact the target - you
can verify proper isolation with a multimeter.</span> <br>
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<span dir="ltr" style="margin-top:0; margin-bottom:0">If the cylinder is a screw-on cap, place a temporary spacer (for example, a small piece of Teflon sheet) between the cap edge and the target when tightening to ensure a sufficient gap. Remove the spacer
after you’ve adjusted the fit.</span> <br>
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<span dir="ltr" style="margin-top:0; margin-bottom:0">I hope it helps.</span> <br>
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<span dir="ltr" style="margin-top:0; margin-bottom:0">Philipp</span> <br>
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<p>14.10.2025 04:34:37 Mohammad Mohtasim Hamid Pial <mpial001@fiu.edu>:</p>
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Dear All, </div>
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I am attempting to deposit NiFe using a magnetron sputtering setup (Angstrom Engineering – Nexdep PVD platform). Below are my target specifications and sputtering parameters:
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Target: NiFe (2" dia × 1 mm, 4N purity) bonded to a 1/8" Cu backing plate </div>
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Sputtering Method: DC Magnetron Sputtering </div>
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DC Power: 100–150 W </div>
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Base Pressure: ~10⁻⁶ Torr </div>
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Ar Gas Flow Rate: 20–30 sccm </div>
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Working Pressure: 3–5 mTorr </div>
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However, I am unable to ignite the plasma. The DC power supply setpoint keeps blinking and the power stalls around 15 W before dropping
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Could this issue be due to insufficient magnetic field strength (not penetrating the thick target/Cu backing), or is the target too thick for effective plasma ignition? Do I need a thinner target or additional magnetic confinement?
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I would greatly appreciate any insights or recommendations from anyone who has sputtered NiFe or similar high-permeability alloys on this platform.
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Thank you in advance! <br>
Pial </div>
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