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<span dir="ltr" style="margin-top:0; margin-bottom:0;">Hello Pial,</span>
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<br><span dir="ltr" style="margin-top:0; margin-bottom:0;">Sounds like a problem of the thickness of the target. Typically a cylindrical shield surrounds the target and must be electrically isolated from it. Make sure the cylinder does not contact the target - you can verify proper isolation with a multimeter.</span>
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<br><span dir="ltr" style="margin-top:0; margin-bottom:0;">If the cylinder is a screw-on cap, place a temporary spacer (for example, a small piece of Teflon sheet) between the cap edge and the target when tightening to ensure a sufficient gap. Remove the spacer after you’ve adjusted the fit.</span>
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<br><span dir="ltr" style="margin-top:0; margin-bottom:0;">I hope it helps.</span>
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<br><span dir="ltr" style="margin-top:0; margin-bottom:0;">Philipp</span>
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<p>14.10.2025 04:34:37 Mohammad Mohtasim Hamid Pial <mpial001@fiu.edu>:</p>
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Dear All,
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I am attempting to deposit NiFe using a magnetron sputtering setup (Angstrom Engineering – Nexdep PVD platform). Below are my target specifications and sputtering parameters:
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Target: NiFe (2" dia × 1 mm, 4N purity) bonded to a 1/8" Cu backing plate
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Sputtering Method: DC Magnetron Sputtering
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DC Power: 100–150 W
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Base Pressure: ~10⁻⁶ Torr
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Ar Gas Flow Rate: 20–30 sccm
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Working Pressure: 3–5 mTorr
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However, I am unable to ignite the plasma. The DC power supply setpoint keeps blinking and the power stalls around 15 W before dropping
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Could this issue be due to insufficient magnetic field strength (not penetrating the thick target/Cu backing), or is the target too thick for effective plasma ignition? Do I need a thinner target or additional magnetic confinement?
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I would greatly appreciate any insights or recommendations from anyone who has sputtered NiFe or similar high-permeability alloys on this platform.
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Thank you in advance!
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Pial
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