<div dir="ltr"><div><div class="gmail_default" style="font-family:georgia,serif">In agreement with what the others said:</div><div class="gmail_default" style="font-family:georgia,serif"><br></div><div class="gmail_default" style="font-family:georgia,serif"><div style="font-family:Arial,Helvetica,sans-serif">We have both.</div><div dir="auto" style="font-family:Arial,Helvetica,sans-serif"><br></div><div dir="auto" style="font-family:Arial,Helvetica,sans-serif">The advantages and disadvantages are typical to all automated tools, versus manual fab.</div><div dir="auto" style="font-family:Arial,Helvetica,sans-serif">Automated coat+develop <i>may</i> add some Reproducibility across different users (meaning different users can get the same results)</div><div dir="auto" style="font-family:Arial,Helvetica,sans-serif">But often significantly reduces flexibility, because automated handling needs the wafers to be nearly identical.  Also a limited number of photoresists/developers can be loaded into the tool.</div><div dir="auto" style="font-family:Arial,Helvetica,sans-serif">Automation adds maintenance costs and for only 1-2 piece parts/wafers does not speed up the process (just as fast to use beakers). The additional maintenance and programming complexity may even make it slower than manual processing if you're only running 1-2 parts.</div><div dir="auto" style="font-family:Arial,Helvetica,sans-serif">Automation makes a lot of sense when you are doing many repeat processes (no/little change in chemicals), and all substrates are the same form factor (eg. 6" wafers only), so the additional set up time and maintenance for the tool is negligible compared to the higher volume going through.</div><div dir="auto" style="font-family:Arial,Helvetica,sans-serif"><br></div><div dir="auto" style="font-family:Arial,Helvetica,sans-serif">We have a huge variety of different substrate sizes (few-mm up to 6" wafers) and a variety of many different developers and photo resist for many diffferent litho tools.</div><div dir="auto" style="font-family:Arial,Helvetica,sans-serif">So manual processing (incl. develop) is much faster for most users, especially if they are only running two or three pieces at a time, or if they are changing piece size, etc.  </div><div style="font-family:Arial,Helvetica,sans-serif"><br></div><div style="font-family:Arial,Helvetica,sans-serif">Even our industrial users running 4" wafers almost entirely do manual develop <i>instead</i> of using the available autocoater because the speed isn't higher, it has more mechanical problems, and the repeatability of manual develop is actually pretty high, as long as you document+train the methods well (how you agitate, which glassware/holder etc.).</div><div dir="auto" style="font-family:Arial,Helvetica,sans-serif"><br></div><div dir="auto" style="font-family:Arial,Helvetica,sans-serif">However, for some of our internal calibration processes, we use the automated tool for coating + bake + develop since we are running many identical processes, they are always full wafers - and most importantly, we want to get through 15-25 wafers so would rather hit "go" and come back later; the maintenance difficulties are worth the throughput for my staff here.</div><div dir="auto" style="font-family:Arial,Helvetica,sans-serif"><br></div></div></div><div><div dir="ltr" class="gmail_signature" data-smartmail="gmail_signature"><div dir="ltr"><font face="georgia, serif" size="4">-- Demis </font><font face="georgia, serif" size="1">(<a href="https://wiki.nanotech.ucsb.edu/wiki/Demis_D._John" target="_blank">contact info</a>)</font><div><i style="font-family:"times new roman",serif">Reminder</i><span style="font-family:"times new roman",serif">: The NanoFab has a </span><a href="https://wiki.nanotech.ucsb.edu/wiki/Frequently_Asked_Questions#Publications_acknowledging_the_Nanofab" style="font-family:"times new roman",serif" target="_blank">publications policy</a><font face="georgia, serif" size="4"><br></font></div></div></div></div><br></div><br><div class="gmail_quote gmail_quote_container"><div dir="ltr" class="gmail_attr">On Thu, Apr 16, 2026 at 4:43 PM Iulian Codreanu <<a href="mailto:codreanu@udel.edu">codreanu@udel.edu</a>> wrote:<br></div><blockquote class="gmail_quote" style="margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padding-left:1ex"><u></u>

  
    
  
  <div>
    Dear colleagues,<br>
    <br>
    When we started the cleanroom at UDel we worked with CEE to develop
    a developing station based on their spinners. It was a lot cheaper
    than the figure Yong mentioned.  It has sat largely unused because
    the vast majority of our users work with small pieces.
    <pre cols="72">iulian Codreanu, Ph.D.
Director, Nanofabrication Facility
University of Delaware
Harker ISE Lab, Room 163
221 Academy Street
Newark, DE 19716
302-831-2784
<a href="https://udnf.udel.edu" target="_blank">https://udnf.udel.edu</a></pre>
    <br>
    <div>On 4/15/2026 4:44 PM, Sun, Yong wrote:<br>
    </div>
    <blockquote type="cite">
      
      <div>Hi Kurt,</div>
      <div><br>
      </div>
      <div>I would add a few points here following Garry’s excellent
        advice:</div>
      <div>(1). CNF had the luxury of acquiring the robust Auto Spin
        Develop systems, which were designed for production. If you
        don’t have the big budget (>>$100k per system), a cheaper
        auto spin develop system can add a lot more maintenance work for
        the tool manager. This is the common drawback of a cheap auto
        spin develop systems not mentioned in Garry’s post.</div>
      <div>(2). If you have a lot more users working with small chips,
        the benefit of an auto spin develop system is also not obvious,
        as users have to use a carrier wafer every time, which can be
        painful to prepare.</div>
      <div>(3) The advantages of an auto spin develop system will only
        shine when most of your users do the majority of their
        fabrication on standard size wafers (e.g. 4”, 6” or 8”).
        Comparing to manual developing procedures, the consistency of
        the auto spin develop system is simply amazing.</div>
      <div style="font-family:inherit;font-size:inherit;color:inherit;background-color:transparent">
        <br>
      </div>
      <div style="font-family:inherit;font-size:inherit;color:inherit;background-color:transparent">
        For advanced lithography using steppers, it’s also recommended
        that the cleanroom facility should be equipped with some
        automated systems, such as the auto spin develop system, auto
        spin rinse system, auto spin etch system…etc. When throughput,
        consistency, uniformity are required for your applications, such
        automated systems will deliver the magic.</div>
      <div style="font-family:inherit;font-size:inherit;color:inherit;background-color:transparent">
        <br>
      </div>
      <div style="font-family:inherit;font-size:inherit;color:inherit;background-color:transparent">
        Best,</div>
      <div style="font-family:inherit;font-size:inherit;color:inherit;background-color:transparent">
        Yong Sun</div>
      <br>
      <hr style="display:inline-block;width:98%">
      <div id="m_-8383601727602865801divRplyFwdMsg" dir="ltr"><font face="Calibri, sans-serif" style="font-size:11pt" color="#000000"><b>From:</b> labnetwork
          <a href="mailto:labnetwork-bounces@mtl.mit.edu" target="_blank"><labnetwork-bounces@mtl.mit.edu></a> on behalf of Garry J.
          Bordonaro <a href="mailto:bordonaro@cnf.cornell.edu" target="_blank"><bordonaro@cnf.cornell.edu></a><br>
          <b>Sent:</b> Wednesday, April 15, 2026 11:37 AM<br>
          <b>To:</b> 'Kurt Kupcho' <a href="mailto:kurt.kupcho@wisc.edu" target="_blank"><kurt.kupcho@wisc.edu></a>;
          <a href="mailto:labnetwork@mtl.mit.edu" target="_blank">labnetwork@mtl.mit.edu</a> <a href="mailto:labnetwork@mtl.mit.edu" target="_blank"><labnetwork@mtl.mit.edu></a><br>
          <b>Subject:</b> Re: [labnetwork] litho spin developer</font>
        <div> </div>
      </div>
      <div lang="EN-US">
        <div>
          <p><span style="font-size:11pt;font-family:Calibri,sans-serif">Kurt,</span></p>
          <p><span style="font-size:11pt;font-family:Calibri,sans-serif"> </span></p>
          <p><span style="font-size:11pt;font-family:Calibri,sans-serif">We
              have been using automated developers for over 20 years. 
              The advantages are *<b>reproducibility</b>*, reduced
              chemical usage, reduced glassware usage. 
            </span></p>
          <p><span style="font-size:11pt;font-family:Calibri,sans-serif"> </span></p>
          <p><span style="font-size:11pt;font-family:Calibri,sans-serif">The
              only disadvantage for us is maintenance, although that is
              generally quite low.  You may have issues with chemical
              disposal depending on your local rules and the particular
              equipment you use.  Piece work can be done with some
              effort and special chucks.</span></p>
          <p><span style="font-size:11pt;font-family:Calibri,sans-serif"> </span></p>
          <p><span style="font-size:11pt;font-family:Calibri,sans-serif">Users
              like them as they get better and more consistent results,
              and do not have to deal with pouring chemicals and
              glassware.</span></p>
          <p><span style="font-size:11pt;font-family:Calibri,sans-serif"> </span></p>
          <p><span style="font-size:11pt;font-family:Calibri,sans-serif">The
              tools can be expensive.  We got ours during the 2000
              bubble crash auctions.</span></p>
          <p><span style="font-size:11pt;font-family:Calibri,sans-serif"> </span></p>
          <p><span style="font-size:11pt;font-family:Calibri,sans-serif"> </span></p>
          <div>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif">Garry
                J. Bordonaro</span></p>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif">Microlithographic
                Engineer</span></p>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif">Cornell
                NanoScale Facility</span></p>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif">250
                Duffield Hall</span></p>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif">343
                Campus Road</span></p>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif">Ithaca
                NY 14853-2700</span></p>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif">(607)
                254-4936</span></p>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif"><a href="mailto:bordonaro@cnf.cornell.edu" target="_blank"><span style="color:blue">bordonaro@cnf.cornell.edu</span></a></span></p>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif"><a href="http://www.cnf.cornell.edu/" target="_blank"><span style="color:blue">http://www.cnf.cornell.edu/</span></a></span></p>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif"> </span></p>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif">Please
                acknowledge CNF in your publications:</span></p>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif">"This
                work was performed in part at the Cornell NanoScale
                Science & Technology Facility (CNF), a member of the
                National Nanotechnology Coordinated Infrastructure
                (NNCI), which is supported by the National Science
                Foundation (Grant NNCI-2025233)."</span></p>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif"> </span></p>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif"> </span></p>
            <p><span style="font-size:11pt;font-family:Calibri,sans-serif"> </span></p>
          </div>
          <p><span style="font-size:11pt;font-family:Calibri,sans-serif"> </span></p>
          <div>
            <div style="border-right:none;border-bottom:none;border-left:none;border-top:1pt solid rgb(225,225,225);padding:3pt 0in 0in">
              <p><b><span style="font-size:11pt;font-family:Calibri,sans-serif">From:</span></b><span style="font-size:11pt;font-family:Calibri,sans-serif">
                  labnetwork <a href="mailto:labnetwork-bounces@mtl.mit.edu" target="_blank"><labnetwork-bounces@mtl.mit.edu></a>
                  <b>On Behalf Of </b>Kurt Kupcho<br>
                  <b>Sent:</b> Tuesday, April 14, 2026 10:25 AM<br>
                  <b>To:</b> <a href="mailto:labnetwork@mtl.mit.edu" target="_blank">labnetwork@mtl.mit.edu</a><br>
                  <b>Subject:</b> [labnetwork] litho spin developer</span></p>
            </div>
          </div>
          <p> </p>
          <p><span style="font-size:11pt">Hi all</span></p>
          <p><span style="font-size:11pt"> </span></p>
          <p><span style="font-size:11pt">I was
              wondering who out there has litho spin developers vs.
              doing litho development manually with dishes. 
            </span></p>
          <p><span style="font-size:11pt"> </span></p>
          <p><span style="font-size:11pt">Do you
              users/students like the spin developer?</span></p>
          <p><span style="font-size:11pt"> </span></p>
          <p><span style="font-size:11pt">Advantages
              and disadvantages of the spin developer?</span></p>
          <p><span style="font-size:11pt"> </span></p>
          <p><span style="font-size:11pt">Any
              opinions and guidance would be much appreciated!</span></p>
          <p><span style="font-size:11pt"> </span></p>
          <p><span style="font-size:11pt">Thank
              you</span></p>
          <p><span style="font-size:11pt">Kurt</span></p>
          <p><span style="font-size:11pt"> </span></p>
          <div style="border-top:none;border-right:none;border-left:none;border-bottom:3pt dotted windowtext;padding:0in 0in 1pt">
            <p><span style="font-size:11pt"> </span></p>
          </div>
          <p><span style="font-size:11pt">Kurt
              Kupcho</span></p>
          <p><span style="font-size:11pt">Materials
              Science Engineer</span></p>
          <p><span style="font-size:11pt">Nanoscale
              Fabrication Center (NFC)</span></p>
          <p><span style="font-size:11pt">University
              of Wisconsin</span></p>
          <p><span style="font-size:11pt">1550
              Engineering Dr.</span></p>
          <p><span style="font-size:11pt">ECB 3110</span></p>
          <p><span style="font-size:11pt">Madison,
              WI  53706</span></p>
          <p><span lang="ES" style="font-size:11pt">E:  </span><span style="font-size:11pt"><a href="mailto:kurt.kupcho@wisc.edu" target="_blank"><span lang="ES">kurt.kupcho@wisc.edu</span></a></span><span lang="ES" style="font-size:11pt"></span></p>
          <p><span lang="ES" style="font-size:11pt">T:  608-262-2982</span></p>
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          <p> </p>
        </div>
      </div>
      <br>
      <fieldset></fieldset>
      <pre>_______________________________________________
labnetwork mailing list
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</pre>
    </blockquote>
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