<div dir="auto">Hello,<div dir="auto"><br></div><div dir="auto">I had made some wire bonding on PCB, for one of my projects. It was definitely a bit tricky initially. Please see this paper and supplimentary info if it's useful</div><div dir="auto"><br></div><div dir="auto"><a href="https://iopscience.iop.org/article/10.1088/1361-6528/ade318/meta">https://iopscience.iop.org/article/10.1088/1361-6528/ade318/meta</a> </div><div dir="auto"><br></div><div dir="auto">Regards,</div><div dir="auto">Sajeer </div></div><br><div class="gmail_quote gmail_quote_container"><div dir="ltr" class="gmail_attr">On Thu, 2 Jul, 2026, 1:07 pm Russ Renzas, <<a href="mailto:rrenzas@unr.edu">rrenzas@unr.edu</a>> wrote:<br></div><blockquote class="gmail_quote" style="margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padding-left:1ex">



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For a summer lab class we're trying to have students make a chip and wirebond it to a PCB. We're having trouble wirebonding to the immersion gold pads though.</div>
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Is it okay to put pcbs in our ebeam evaporator to evaporate Au? </div>
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We tried a small piece in a Au SEM prep sputter coater and that worked but it's too small for the class PCBs.</div>
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Thanks, also appreciate any tips on how to spec pcb metalization for wirebonding compatibility. We have both Al ultrasonic wedge and Au ball bond capabilities.</div>
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Russ Renzas</div>
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University of Nevada, Reno</div>
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