<div dir="auto">Thank you all for the replies. I've used ENIG for so long, starting during my PhD because one of my undergrad minions ordered it and I've never had much trouble. But, I'm going to try ENEPIG next time on all your recommendations because it seems like it may prevent some of the issues that occasionally arise. Thanks!</div><div dir="auto"><br></div><div dir="auto">Mike</div><div><br><div class="gmail_quote gmail_quote_container"><div dir="ltr" class="gmail_attr">On Thu, Jul 2, 2026 at 18:32 CELSO RENATO PETER <<a href="mailto:cepeter@unisinos.br">cepeter@unisinos.br</a>> wrote:<br></div><blockquote class="gmail_quote" style="margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padding-left:1ex">
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Hi Russ,</div>
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For wirebonding on PCBs you will need Soft Gold or ENEPIG metallization (Electroless Nickel, Electroless Palladium, Immersion Gold), many PCB manufactures already offer ENEPIG metallization.</div>
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ENIG finishing is not apropriate for wire bonding, the gold layer is too thin and Nickel is too hard.</div>
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ENEPIG is also a good finishing for Tin soldering (solder paste), so it is very flexible.</div>
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For Soft Gold finishing the minimum Gold thickness shoul be 200 nm (0,2 um), ideal is 300 nm.</div>
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<span style="font-family:Calibri,Arial,Helvetica,sans-serif;font-size:14.6667px;color:rgb(0,0,0)">Celso Peter</span><span style="font-family:Calibri,Arial,Helvetica,sans-serif;font-size:12pt;color:rgb(0,0,0)"><br>
</span><span style="font-family:Calibri,Arial,Helvetica,sans-serif;font-size:11pt;color:rgb(0,0,0)">Coordenador - Instituto Tecnológico de Semicondutores - itt Chip</span><span style="font-family:Calibri,Arial,Helvetica,sans-serif;font-size:12pt;color:rgb(0,0,0)"><br>
</span><span style="font-family:Calibri,Arial,Helvetica,sans-serif;font-size:11pt;color:rgb(0,0,0)">Unisinos - Somos infinitas possibilidades</span><span style="font-family:Calibri,Arial,Helvetica,sans-serif;font-size:12pt;color:rgb(0,0,0)"><br>
</span><span style="font-family:Calibri,Arial,Helvetica,sans-serif;font-size:11pt;color:rgb(0,0,0)"><a href="http://www.unisinos.br/" id="m_4688361805135877045LPNoLP" style="margin-top:0px;margin-bottom:0px;font-family:Calibri,Arial,Helvetica,sans-serif" target="_blank">www.unisinos.br</a> -
(51) 3591-1122 / Ramal 3180</span><span style="font-family:Calibri,Arial,Helvetica,sans-serif;font-size:12pt;color:rgb(0,0,0)"><br>
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<div id="m_4688361805135877045divRplyFwdMsg" dir="ltr"><font face="Calibri, sans-serif" style="font-size:11pt;font-family:Calibri,sans-serif;color:rgb(0,0,0)"><b style="font-family:Calibri,sans-serif">De:</b> labnetwork <<a href="mailto:labnetwork-bounces@mtl.mit.edu" target="_blank" style="font-family:Calibri,sans-serif">labnetwork-bounces@mtl.mit.edu</a>> em nome de Russ Renzas <<a href="mailto:rrenzas@unr.edu" target="_blank" style="font-family:Calibri,sans-serif">rrenzas@unr.edu</a>><br>
<b style="font-family:Calibri,sans-serif">Enviado:</b> quarta-feira, 1 de julho de 2026 23:10<br>
<b style="font-family:Calibri,sans-serif">Para:</b> Network Fab <<a href="mailto:labnetwork@mtl.mit.edu" target="_blank" style="font-family:Calibri,sans-serif">labnetwork@mtl.mit.edu</a>><br>
<b style="font-family:Calibri,sans-serif">Cc:</b> Lihua Xiao <<a href="mailto:lxiao@unr.edu" target="_blank" style="font-family:Calibri,sans-serif">lxiao@unr.edu</a>><br>
<b style="font-family:Calibri,sans-serif">Assunto:</b> [labnetwork] PCB in e-beam evaporator?</font>
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For a summer lab class we're trying to have students make a chip and wirebond it to a PCB. We're having trouble wirebonding to the immersion gold pads though.</div>
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Is it okay to put pcbs in our ebeam evaporator to evaporate Au? </div>
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We tried a small piece in a Au SEM prep sputter coater and that worked but it's too small for the class PCBs.</div>
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Thanks, also appreciate any tips on how to spec pcb metalization for wirebonding compatibility. We have both Al ultrasonic wedge and Au ball bond capabilities.</div>
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Russ Renzas</div>
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University of Nevada, Reno</div>
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