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Hi Russ,</div>
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For wirebonding on PCBs you will need Soft Gold or ENEPIG metallization (Electroless Nickel, Electroless Palladium, Immersion Gold), many PCB manufactures already offer ENEPIG metallization.</div>
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ENIG finishing is not apropriate for wire bonding, the gold layer is too thin and Nickel is too hard.</div>
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ENEPIG is also a good finishing for Tin soldering (solder paste), so it is very flexible.</div>
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For Soft Gold finishing the minimum Gold thickness shoul be 200 nm (0,2 um), ideal is 300 nm.</div>
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<span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 14.6667px; color: rgb(0, 0, 0);">Celso Peter</span><span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 12pt; color: rgb(0, 0, 0);"><br>
</span><span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 11pt; color: rgb(0, 0, 0);">Coordenador - Instituto Tecnológico de Semicondutores - itt Chip</span><span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 12pt; color: rgb(0, 0, 0);"><br>
</span><span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 11pt; color: rgb(0, 0, 0);">Unisinos - Somos infinitas possibilidades</span><span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 12pt; color: rgb(0, 0, 0);"><br>
</span><span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 11pt; color: rgb(0, 0, 0);"><a href="http://www.unisinos.br/" target="_blank" id="LPNoLP" class="OWAAutoLink" style="margin-top: 0px; margin-bottom: 0px;">www.unisinos.br</a> -
(51) 3591-1122 / Ramal 3180</span><span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 12pt; color: rgb(0, 0, 0);"><br>
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<div id="divRplyFwdMsg" dir="ltr"><font face="Calibri, sans-serif" style="font-size:11pt" color="#000000"><b>De:</b> labnetwork <labnetwork-bounces@mtl.mit.edu> em nome de Russ Renzas <rrenzas@unr.edu><br>
<b>Enviado:</b> quarta-feira, 1 de julho de 2026 23:10<br>
<b>Para:</b> Network Fab <labnetwork@mtl.mit.edu><br>
<b>Cc:</b> Lihua Xiao <lxiao@unr.edu><br>
<b>Assunto:</b> [labnetwork] PCB in e-beam evaporator?</font>
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For a summer lab class we're trying to have students make a chip and wirebond it to a PCB. We're having trouble wirebonding to the immersion gold pads though.</div>
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Is it okay to put pcbs in our ebeam evaporator to evaporate Au? </div>
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We tried a small piece in a Au SEM prep sputter coater and that worked but it's too small for the class PCBs.</div>
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Thanks, also appreciate any tips on how to spec pcb metalization for wirebonding compatibility. We have both Al ultrasonic wedge and Au ball bond capabilities.</div>
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Russ Renzas</div>
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University of Nevada, Reno</div>
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