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Hi Russ, </div>
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You might try giving the pads on the PCB a thorough cleaning in O2 plasma in case they may have some organic schmutz on them. </div>
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-Michael </div>
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<div id="divRplyFwdMsg" dir="ltr"><font face="Calibri, sans-serif" style="font-size:11pt" color="#000000"><b>From:</b> labnetwork <labnetwork-bounces@mtl.mit.edu> on behalf of Russ Renzas <rrenzas@unr.edu><br>
<b>Sent:</b> Wednesday, July 1, 2026 10:10 PM<br>
<b>To:</b> Network Fab <labnetwork@mtl.mit.edu><br>
<b>Cc:</b> Lihua Xiao <lxiao@unr.edu><br>
<b>Subject:</b> [labnetwork] PCB in e-beam evaporator?</font>
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For a summer lab class we're trying to have students make a chip and wirebond it to a PCB. We're having trouble wirebonding to the immersion gold pads though.</div>
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Is it okay to put pcbs in our ebeam evaporator to evaporate Au? </div>
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We tried a small piece in a Au SEM prep sputter coater and that worked but it's too small for the class PCBs.</div>
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Thanks, also appreciate any tips on how to spec pcb metalization for wirebonding compatibility. We have both Al ultrasonic wedge and Au ball bond capabilities.</div>
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Russ Renzas</div>
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University of Nevada, Reno</div>
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