<div dir="ltr"><div dir="ltr"><div><div class="gmail_default" style="font-family:arial,helvetica,sans-serif"><br></div></div><div><div dir="ltr" class="gmail_signature" data-smartmail="gmail_signature"><div dir="ltr"><div><div dir="ltr"><div><div dir="ltr"><div><div dir="ltr"><div><div dir="ltr"><div style="margin:0px;padding:0px 0px 20px;width:1504px"><div style="font-size:medium;font-family:Roboto,RobotoDraft,Helvetica,Arial,sans-serif"><div></div><div><div></div></div></div><div style="font-size:medium;font-family:Roboto,RobotoDraft,Helvetica,Arial,sans-serif"></div></div></div></div></div></div></div></div></div></div></div></div></div><div class="gmail_default" style="font-family:arial,helvetica,sans-serif"><span style="font-family:Arial,Helvetica,sans-serif;background-color:transparent">Hi Russ,</span></div><p>All the comments so far are valid and important to consider. Wire bonding on the right PCB finish should be relatively straightforward.</p><p>I would like to add another recommendation: if possible for your project, please ask your provider about alternative substrates for your board, such as ceramics, Rogers materials, or flexible substrates (like Polyimide/PI).</p><p><span class="gmail_default" style="font-family:arial,helvetica,sans-serif"></span>B<span class="gmail_default" style="font-family:arial,helvetica,sans-serif">est</span>,</p><p>Mo Khodadadi</p><br></div><div id="m_2476868113560469279DAB4FAD8-2DD7-40BB-A1B8-4E2AA1F9FDF2"><br><table style="border-top:1px solid #d3d4de"><tbody><tr><td style="width:55px;padding-top:13px"><a href="http://www.avg.com/email-signature?utm_medium=email&utm_source=link&utm_campaign=sig-email&utm_content=webmail" target="_blank"><img src="https://s-install.avcdn.net/ipm/preview/icons/icon-envelope-tick-green-avg-v1.png" alt="" width="46" height="29" style="width:46px;height:29px"></a></td><td style="width:470px;padding-top:12px;color:#41424e;font-size:13px;font-family:Arial,Helvetica,sans-serif;line-height:18px">Virus-free.<a href="http://www.avg.com/email-signature?utm_medium=email&utm_source=link&utm_campaign=sig-email&utm_content=webmail" style="color:#4453ea" target="_blank">www.avg.com</a></td></tr></tbody></table><a href="#m_2476868113560469279_DAB4FAD8-2DD7-40BB-A1B8-4E2AA1F9FDF2" width="1" height="1"></a></div></div><br><div class="gmail_quote"><div dir="ltr" class="gmail_attr">On Thu, Jul 2, 2026 at 6:12 PM Martin, Michael <<a href="mailto:michael.martin@louisville.edu" target="_blank">michael.martin@louisville.edu</a>> wrote:<br></div><blockquote class="gmail_quote" style="margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);padding-left:1ex"><div>
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Hi Russ, </div>
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You might try giving the pads on the PCB a thorough cleaning in O2 plasma in case they may have some organic schmutz on them. </div>
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-Michael </div>
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<div id="m_2476868113560469279m_1409739807784217473divRplyFwdMsg" dir="ltr"><font face="Calibri, sans-serif" style="font-size:11pt" color="#000000"><b>From:</b> labnetwork <<a href="mailto:labnetwork-bounces@mtl.mit.edu" target="_blank">labnetwork-bounces@mtl.mit.edu</a>> on behalf of Russ Renzas <<a href="mailto:rrenzas@unr.edu" target="_blank">rrenzas@unr.edu</a>><br>
<b>Sent:</b> Wednesday, July 1, 2026 10:10 PM<br>
<b>To:</b> Network Fab <<a href="mailto:labnetwork@mtl.mit.edu" target="_blank">labnetwork@mtl.mit.edu</a>><br>
<b>Cc:</b> Lihua Xiao <<a href="mailto:lxiao@unr.edu" target="_blank">lxiao@unr.edu</a>><br>
<b>Subject:</b> [labnetwork] PCB in e-beam evaporator?</font>
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For a summer lab class we're trying to have students make a chip and wirebond it to a PCB. We're having trouble wirebonding to the immersion gold pads though.</div>
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Is it okay to put pcbs in our ebeam evaporator to evaporate Au? </div>
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We tried a small piece in a Au SEM prep sputter coater and that worked but it's too small for the class PCBs.</div>
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Thanks, also appreciate any tips on how to spec pcb metalization for wirebonding compatibility. We have both Al ultrasonic wedge and Au ball bond capabilities.</div>
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Russ Renzas</div>
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University of Nevada, Reno</div>
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