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Hello all,</div>
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We are performing wirebonding (fully automatic and semi automatic) on PCBs using either the ball or the wedge of our M17S from FK Delvotek.</div>
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>From experience the ENIG finish from JLCPCB or PCBway is enough to provide adhesion for the wirebonding to be successful. (This is good enough for small series we have not tried doing it at production scale and speed).</div>
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However, we do recommend cleaning the PCB using IPA and/or Acetone before wireboding to make sure contaminents have been removed (i.e. fingerprints, traces of flux, epoxy...).</div>
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A plasma clean can also be usefull but is not needed.</div>
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In my experience, the main reasons why the wirebonding fails on PCB is mostly the improper attachment of the PCB on top of the heater from the wirebonder.</div>
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Also large PCBs (10cm+) with multiple areas where to wirebond come with their own set of challenges as the FR4 might warp due to the heat, so the solution might be to concentrate on 1 area at a time.</div>
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Best,</div>
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Mathieu</div>
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LaCIME - École de Technologie Supérieure</div>
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Montréal - Canada</div>
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<b>From:</b> labnetwork <labnetwork-bounces@mtl.mit.edu> on behalf of CELSO RENATO PETER <cepeter@unisinos.br><br>
<b>Sent:</b> Thursday, July 2, 2026 9:15 AM<br>
<b>To:</b> Russ Renzas <rrenzas@unr.edu>; Network Fab <labnetwork@mtl.mit.edu><br>
<b>Cc:</b> Lihua Xiao <lxiao@unr.edu><br>
<b>Subject:</b> Re: [labnetwork] PCB in e-beam evaporator?</div>
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<div style="direction: ltr;"><b>[ATTENTION : Ce courriel provient de l'extérieur de l'ÉTS]<br>
</b>Évitez de cliquer sur un lien ou d'ouvrir une pièce jointe si vous ne connaissez pas l'expéditeur du courriel. En cas de doute, veuillez SVP créer un billet
<a href="https://gus.etsmtl.ca/c2atom/LoginAzure?landingPage=/portal-request-form/714d9e14-bc17-47b8-a0e6-e154184ecbc2" id="OWA32333dd8-d38b-edb3-249c-775c0ae0a434" class="OWAAutoLink" data-auth="NotApplicable">
Problème de courriel au GUS</a> .</div>
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Hi Russ,</div>
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For wirebonding on PCBs you will need Soft Gold or ENEPIG metallization (Electroless Nickel, Electroless Palladium, Immersion Gold), many PCB manufactures already offer ENEPIG metallization.</div>
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ENIG finishing is not apropriate for wire bonding, the gold layer is too thin and Nickel is too hard.</div>
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ENEPIG is also a good finishing for Tin soldering (solder paste), so it is very flexible.</div>
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For Soft Gold finishing the minimum Gold thickness shoul be 200 nm (0,2 um), ideal is 300 nm.</div>
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<p style="direction: ltr; margin-top: 1em; margin-bottom: 1em;"><span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 14.6667px; color: rgb(0, 0, 0);">Celso Peter</span><span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 12pt; color: rgb(0, 0, 0);"><br>
</span><span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 11pt; color: rgb(0, 0, 0);">Coordenador - Instituto Tecnológico de Semicondutores - itt Chip</span><span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 12pt; color: rgb(0, 0, 0);"><br>
</span><span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 11pt; color: rgb(0, 0, 0);">Unisinos - Somos infinitas possibilidades</span><span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 12pt; color: rgb(0, 0, 0);"><br>
</span><span style="font-family: Calibri, Arial, Helvetica, sans-serif; font-size: 11pt; color: rgb(0, 0, 0);"><a href="http://www.unisinos.br/" id="OWAb4f074ab-19cc-0014-b024-575c648eb133" class="x_OWAAutoLink" style="margin-top: 0px; margin-bottom: 0px;" originalsrc="http://www.unisinos.br/" data-auth="NotApplicable">www.unisinos.br</a> -
(51) 3591-1122 / Ramal 3180</span></p>
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<b>De:</b> labnetwork <labnetwork-bounces@mtl.mit.edu> em nome de Russ Renzas <rrenzas@unr.edu><br>
<b>Enviado:</b> quarta-feira, 1 de julho de 2026 23:10<br>
<b>Para:</b> Network Fab <labnetwork@mtl.mit.edu><br>
<b>Cc:</b> Lihua Xiao <lxiao@unr.edu><br>
<b>Assunto:</b> [labnetwork] PCB in e-beam evaporator?</div>
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For a summer lab class we're trying to have students make a chip and wirebond it to a PCB. We're having trouble wirebonding to the immersion gold pads though.</div>
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Is it okay to put pcbs in our ebeam evaporator to evaporate Au? </div>
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We tried a small piece in a Au SEM prep sputter coater and that worked but it's too small for the class PCBs.</div>
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Thanks, also appreciate any tips on how to spec pcb metalization for wirebonding compatibility. We have both Al ultrasonic wedge and Au ball bond capabilities.</div>
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Russ Renzas</div>
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University of Nevada, Reno</div>
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