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Hi Filippo-<br>
<br>
We have 2 Aja Orion systems here. One is for 4 inch wafers and wafer
pieces, the other can accommodate 6" wafers and pieces.<br>
<br>
We manage these tools differently. The 4 inch tool has fewer
restrictions, meaning that we allow resists for lift off processes
and Kapton tape to secure samples. In the other tool, we don't
allow either of these.<br>
<br>
1- I'm not sure what to say about cross-sputtering. You can
minimize this by using gun positions that are widely spaced, as
opposed to being adjacent or near each other. One thing to be aware
of is the vapor pressure of the materials that you deposit. For
example, sulfur containing compounds tend to have high vapor
pressures. Once this is in your chamber, it may be hard to reach
your original chamber base pressure.<br>
<br>
For chamber and parts cleaning, we have a grit blaster that uses
glass beads to remove deposits.<br>
<br>
Lab users have much higher rates of success with lift off processes
done in our evaporators, but many still use the sputter tools.<br>
<br>
2- We allow a wide range of resists, like LOR 10A. In the photo of
our tool, you may notice an RGA. We generally don't see any peaks
beyond O2 at 32 amu. Photos may not transmit thru Labnetwork.<br>
<br>
3- We are OK with Kapton in one of our tools. The adhesives are
silicone based adhesives, and I can't find outgassing data on these
adhesives no matter whom I ask or where I look.<br>
<br>
Hope this helps,<br>
Gary
<pre class="moz-signature" cols="72">Gary Riggott
508-451-0905</pre>
<br>
<div class="moz-cite-prefix">On 8/10/2026 10:13 PM, #MARTINELLI
FILIPPO# wrote:<br>
</div>
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Dear labnetwork community,</div>
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<br>
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I have recently been put in charge of a UHV magnetron sputtering
system (AJA Orion) that I need to maintain and operate. The
machine is dedicated to co-sputtering of two metals in a
nitrogen environment.</div>
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<br>
</div>
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The previous operator strongly advised me to be careful about
what goes into the chamber, as contamination can affect both the
chamber condition and the properties of the deposited material.
However, she was not very specific about what exactly causes
contamination, and I am unsure how restrictive I should be with
the materials I load.</div>
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<br>
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I have a few questions I would appreciate your opinion on:</div>
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<br>
</div>
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1. I read that cross-sputtering can occur between nearby
substrates, or between the substrate and the chamber. In your
opinion, are there materials that are particularly prone to
cross-sputtering and hard to remove with standard cleaning
routines, and that should therefore be avoided in the chamber
altogether?</div>
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<br>
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2. Following on from that, what is your take on lithography
resists?</div>
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<br>
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3. How about mounting materials such as Kapton tape or
Crystalbond?</div>
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<br>
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I am quite new to this, so any suggestion or recommendation is
welcome. I look forward to hearing your opinions.</div>
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<br>
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Cheers,</div>
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Filippo</div>
<br>
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