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</o:shapelayout></xml><![endif]--></head><body lang=EN-US link="#0563C1" vlink="#954F72"><div class=WordSection1><p class=MsoNormal>Ben,<o:p></o:p></p><p class=MsoNormal><o:p> </o:p></p><p class=MsoNormal>At CNF we have used a Suss AltaSpray for several years with very good success. Ours is integrated into our Gamma cluster, but stand-alone versions are available. ClassOne has one that needs a rebuild. It uses an X Y spray motion with a heated chuck.<o:p></o:p></p><p class=MsoNormal><o:p> </o:p></p><p class=MsoNormal>One of our staff worked out DUV lift-off using HSQ. We also have a C&D lift-off tool with high-pressure jet that give good results on poor processes. I could send the details if you are interested.<o:p></o:p></p><p class=MsoNormal><o:p> </o:p></p><p class=MsoNormal><o:p> </o:p></p><div><p class=MsoNormal>Garry J. Bordonaro<o:p></o:p></p><p class=MsoNormal>Microlithographic Engineer<o:p></o:p></p><p class=MsoNormal>Cornell NanoScale Facility<o:p></o:p></p><p class=MsoNormal>250 Duffield Hall<o:p></o:p></p><p class=MsoNormal>343 Campus Road<o:p></o:p></p><p class=MsoNormal>Ithaca NY 14853-2700<o:p></o:p></p><p class=MsoNormal>(607) 254-4936<o:p></o:p></p><p class=MsoNormal><a href="mailto:bordonaro@cnf.cornell.edu"><span style='color:blue'>bordonaro@cnf.cornell.edu</span></a><o:p></o:p></p><p class=MsoNormal><a href="http://www.cnf.cornell.edu/"><span style='color:blue'>http://www.cnf.cornell.edu/</span></a><o:p></o:p></p><p class=MsoNormal><o:p> </o:p></p><p class=MsoNormal>Please acknowledge CNF in your publications:<o:p></o:p></p><p class=MsoNormal>"This work was performed in part at the Cornell NanoScale Science & Technology Facility (CNF), a member of the National Nanotechnology Coordinated Infrastructure (NNCI), which is supported by the National Science Foundation (Grant NNCI-2025233)."<o:p></o:p></p><p class=MsoNormal><o:p> </o:p></p><p class=MsoNormal><o:p> </o:p></p><p class=MsoNormal><o:p> </o:p></p></div><p class=MsoNormal><o:p> </o:p></p><div><div style='border:none;border-top:solid #E1E1E1 1.0pt;padding:3.0pt 0in 0in 0in'><p class=MsoNormal><b>From:</b> labnetwork <labnetwork-bounces@mtl.mit.edu> <b>On Behalf Of </b>S. J. Ben Yoo<br><b>Sent:</b> Tuesday, September 15, 2026 5:45 PM<br><b>To:</b> Labnetwork <labnetwork@mtl.mit.edu><br><b>Subject:</b> [labnetwork] Photoresist Spray Coater & Spinner<o:p></o:p></p></div></div><p class=MsoNormal><o:p> </o:p></p><p class=MsoNormal>Hi, Everyone,<o:p></o:p></p><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>Two questions for you.<o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>(1) At UC Davis we are trying to acquire a tool that can spin coat and spray coat photoresist. Do you have a good recommendation for a new tool or used one for less than 200k, preferably below 140k?<o:p></o:p></p></div><div><p class=MsoNormal>I received a quotation from EVG for a new tool EVG101. We like what we saw on the spec sheet and descriptions but the price is a bit on the high side for us. Looking for a used unit, I got a quote for an old unit that is not supported (and we need to purchase one that has manufacturers’ support and maintenance).<o:p></o:p></p></div><div><p class=MsoNormal>Any suggestion would be appreciated.<o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal>(2) We are also trying to setup a bilevel resist exposure capability for high resolution metal liftoff. My group members have been using LOR under the photoresist to give an undercut under the photoresist during the development but it is not a well-controlled process.<o:p></o:p></p></div><div><p class=MsoNormal>At my former lab, Bellcore, two types of photoresist : <span class=rqesxe><span style='font-family:"Arial",sans-serif'>g-line (436 nm)</span></span> and <span class=rqesxe><span style='font-family:"Arial",sans-serif'>i-line (365 nm). After the I-line litho and development, using g-line flood exposure at angled spin exposure worked very well.</span></span><o:p></o:p></p></div><div><p class=MsoNormal><span class=rqesxe><span style='font-family:"Arial",sans-serif'>Anyone knows of a good g-line exposure system for bilevel liftoff?</span></span><o:p></o:p></p></div><div><p class=MsoNormal><span class=rqesxe><span style='font-family:"Arial",sans-serif'>We also use DUV ASML stepper, hence we could also try g-line (436 nm) and DUV (248 nm) bilevel liftoff.</span></span><o:p></o:p></p></div><div><p class=MsoNormal><span style='font-family:"Arial",sans-serif'><br><br></span><o:p></o:p></p></div><div><p class=MsoNormal><span style='font-family:"Arial",sans-serif'>Any suggestion would be appreciated.</span><o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal><span style='font-family:"Arial",sans-serif'>Thanks,</span><o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><div><p class=MsoNormal><span style='font-family:"Arial",sans-serif'>-Ben</span><o:p></o:p></p></div><div><p class=MsoNormal><o:p> </o:p></p></div><p class=MsoNormal style='margin-bottom:12.0pt'><o:p> </o:p></p><div><div><div><p class=MsoNormal><span style='color:black'>_______________________________________________________________________________<br><br>S. J. Ben Yoo<br>Joint Faculty LBL and UC Davis <br>Distinguished Professor, Department of Electrical and Computer Engineering<br>Room 3110, Kemper Hall<br>Mail Code 1915<br>University of California<br>Davis, California 95616<br>Mobile: (510) 407-2457<br>Fax: (530) 752-8428<br>email: <a href="mailto:sbyoo@ucdavis.edu">sbyoo@ucdavis.edu</a><br>home page: <a href="http://sierra.ece.ucdavis.edu">http://sierra.ece.ucdavis.edu</a><br>_______________________________________________________________________________ <o:p></o:p></span></p></div></div></div><p class=MsoNormal><o:p> </o:p></p></div></body></html>