[labnetwork] Sputter Oxides & Metals in Same System?

[Philip Kubik]

We have a sputtering & evaporation system with 2 RF & 2 DC cathodes. To
date, we have only sputtered metals but we are considering sputtering oxides
as well. I wonder whether others think this is a good idea or not and what,
if any, chamber cleaning and conditions procedures are used when switching
between oxides & metals. Specifically, the metals currently used in the
system are nickel, titanium, chromium, aluminum, & gold. The oxides that we
are considering are SiO2, TiO2, ZnO, Al2O3, & ITO.

 

I have heard that is not a good idea to sputter metals and oxides in the
same system but I don't know the reasons for this. Also, I know that some
labs have metals only & oxides only sputtering systems, whereas others have
a sputtering system for both metals & oxides. My own experience is with a
system in which SiO2, niobium, aluminum, & molybdenum were deposited. When
metals were sputtered after SiO2 sputtering, there was a lot of arcing in
the deposition chamber, which damaged the devices being fabricated on
silicon wafers. Consequently, after oxide sputtering, the chamber was
conditioned by oxygen glow discharge cleaning and a lengthy metal deposition
until the arcing ceased.

 

Any advice would be greatly appreciated.

 

 

Regards,

Philip Kubik

 

_________________________

 

Philip Kubik, Ph.D.
Cleanroom Engineer
4D Labs, Simon Fraser University
8888 University Dr.
Burnaby, BC, Canada V5A 1S6
Office phone: 778-782-8026

Email:  <mailto:Philip.Kubik at 4DLabs.ca> Kubik at 4DLabs.ca

 

 

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