[labnetwork] Sputter Coating Equipment
Anand Gadre
agadre at ucmerced.edu
Fri Jan 18 17:50:41 EST 2013
Dear Colleagues,
We are planning to purchase a sputter coating machine (new or refurbished) that may be placed in our class 1000 cleanroom at the Stem Cell INstrumentation Foundry (SCIF) at UC Merced. I have already got in touch with one vendor in California (ANATECH USA) and received a quote from him but I would like to contact more manufacturers who would offer best suitable equipment that would fit well with our research needs with better price. Any advice about the manufacturers/vendors of such a machine would be much appreciated.
Here is a list of specific requirements from our users:
1.In need of a more advanced sputter setup for
niobium and niobium nitride deposition. DC/RF magnetron sputtering system. )
Specific Reuirements:
· sputtering machine that can sputter niobium or niobium nitride that becomes superconducting at cryogenic temperatures.
· -DC/RF magnetron sputtering system
· -This requires a cleaned argon discharge that has been passed through a liquid nitrogen trap, either outside or inside the sputtering chamber.
· -The RF sputtering power level should be above 100 Watts.
· -There should be shutters inside the sputtering chamber that can be rotated into, or out of, the front of the sample, at will.
· -There also should be a crystal oscillator thickness monitor so that we can measure the sputtered thickness of the niobium or niobium nitride films.
· -Temperature ranges up to 700C
· -We shouldn't need more than 2 targets for our purpose, but it might be nice to support multiple targets in a user facility
· -sample areas on the order of 10X10 cm
2. In need for a high quality Nb deposition (superconductor). System requirements.
3. Need magnetron sputter for high quality insulating film deposition.
4. Potentially interested in sputtering metal and metal oxide (maybe reactive sputtering?).
5. Indium Tin Oxide (transparent, conductive substrate) deposition needed. High vacuum required.
6. dc/ac magnetron (deposition of both metal and ceramic possible)
- heating up to > 400C (preferably up to 600C)
- Ar pressure range covers 5 mTorr - 50 mTorr (base pressure < 1 mTorr)
- Power > 200 W (both dc and ac)
- Chiller pump flow: > 5 lpm @20 psi
- Feeding oxidant possible (for example, 10% O2 / 90% N2)
Optional
- 4'' wafer size preferred, but smaller ones are still okay
- Substrate rotation control (for uniform deposition)
Thanks,
Anand Gadre, Ph.D, MBA
Director
Stem Cell Instrumentation Foundry (SCIF)
University of California, Merced
5200 N. Lake Road
Merced, CA 95343
Phone: (O): 209-228-2345
Phone (C): (209) 658-3879
Fax: (209) 228 4424
Email: agadre at ucmerced.edu
SCIF website: Scif.ucmerced.edu
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