[labnetwork] Ni evaporation

[Charles Ellis]

Nava,

We have run Ni directly in the copper hearth (i.e. no crucible) for 20 years or more without an issue.  Just make sure you properly cool your hearth and it will be almost impossible to punch a hole in it.

I agree with Rick, Ni is high stress and thick films have been known to pull chucks of silicon from my wafers. A slow rate <0.5A/sec has been our standard for Ni – to reduce the stress.

Charles Ellis
Auburn University

From: Nava Ariel- Sternberg <anava at tauex.tau.ac.il<mailto:anava at tauex.tau.ac.il>>
Date: Monday, March 23, 2015 at 4:30 AM
To: "labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>" <labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>>
Subject: [labnetwork] Ni evaporation

Hi all,

We've came across some issues with Ni e-beam evaporation and thought of consulting the network:

Which crucible are you using for Ni e-beam evaporation? We've tried Al2O3 and Vitreous carbon, both recommended by the material/crucible suppliers.
Any tips with respect to melting the material or the evaporation process itself?

Thanks,

Nava


Nava Ariel-Sternberg, Ph.D.
Tel-Aviv University Center for Nanoscience and Nanotechnology, Managing Director
MNCF Manager
Phone: 03-640-5619
Mobile: 054-9984959
Email: anava at tauex.tau.ac.il<mailto:anava at tauex.tau.ac.il>

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