[labnetwork] Sputter process query

[Gupta, Su]

Sunanda:

There should not be any cross-contamination issues if you pre-sputter and condition the targets before each deposition. You can mix metal and dielectric deposition as lomng as you have a means of presputtering the metal targets.

Best,
Su Gupta
________________________________________
From: labnetwork-bounces at mtl.mit.edu [labnetwork-bounces at mtl.mit.edu] on behalf of sunanda.babu at cense.iisc.ernet.in [sunanda.babu at cense.iisc.ernet.in]
Sent: Saturday, July 23, 2016 7:39 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Sputter process query

Hi all,

Can someone tell me whether there are any cross-contamination issues if I
mix reactive sputtering of AlN, TiN, HfO2, Ta2O5, ITO on my sputter tool?

Can I mix metal sputtering and dielectric sputtering processes? Based on
this information, I would like to see if the tool utilization can be
improved.

thanks and best regards,
sunanda


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