[labnetwork] DC sputtering of ITO

[Gerhard Ulbricht]

Sputtering at lower power will produce less heat and thermal stress and 
can delay flaking, but flakes will still show up when the film deposited 
on your sputter chimney and shutter gets thicker.

What we do for materials that are very prone to flaking (e.g. RF 
sputtered Si or DC sputtered W) is to send out chimney and shutter to 
get their insides arc-spray coated with a very rough and thick Al layer 
- about the surface structure of extra coarse sand paper. That for us 
has stopped Si flaking completely, in contrast to having to clean the 
sputter gun from flakes every 2 weeks. We have to get these parts 
re-coated every time we change a sputter target, but the company 
(Pentagon Technologies) does both the bead blasting and the new coating 
for us (what is very convenient), and it's not expensive.

Best regards,

Gerhard Ulbricht
Department of Physics
Broida Hall
University of California
Santa Barbara CA 93106



On 10/11/2016 4:24 PM, Chang, Long wrote:
> Hi All,
>
> We have a DC magnetron sputtering system using 2" diameter targets. 
>  We've been observing many shorts due to severe flaking.  The student 
> is using a recipe developed by her predecessor which uses 100W of DC 
> power and 5 mTorr of Ar.  Does anyone know what steps should be taken 
> to avoid/reduce flaking when DC sputtering ITO?  I suspect that the 
> student is using too much power.
>
> Thanks,
> Long Chang
> Nanofab Manager
> University of Houston
> 3605 Cullen Blvd, Entrance 14
> Room E1007A, SERC Bldg 545
> Houston, TX 77204-5062
>
>
>
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