[labnetwork] DC sputtering of ITO

[Mark Hofheins]

The power is relative to the target material.

Also the surface roughness will have a bearing on how well the sputtered material holds onto the surrounding chamber parts or flakes off.

Most metals, we run around 200 to 300 watts. If a previous compound has been sputtered and the fixtures have not been cleaned or changed,

flaking will also become an issue.

Good luck.


Mark Hofheins

mhofheins at unm.edu<mailto:mhofheins at unm.edu>

505-710-3527


Micro Electronics Technician

Manufacturing Engineering

University of New Mexico MTTC

800 Bradbury S.E.  Suit 235

Albuquerque, New Mexico

87106-4346


________________________________
From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> on behalf of Chang, Long <lvchang at Central.UH.EDU>
Sent: Tuesday, October 11, 2016 5:24 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] DC sputtering of ITO

Hi All,

We have a DC magnetron sputtering system using 2" diameter targets.  We've been observing many shorts due to severe flaking.  The student is using a recipe developed by her predecessor which uses 100W of DC power and 5 mTorr of Ar.  Does anyone know what steps should be taken to avoid/reduce flaking when DC sputtering ITO?  I suspect that the student is using too much power.

Thanks,
Long Chang
Nanofab Manager
University of Houston
3605 Cullen Blvd, Entrance 14
Room E1007A, SERC Bldg 545
Houston, TX 77204-5062
[cid:3086A57B-3DB1-4B85-8710-71DBF15B4CB1 at uh.edu]



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