[labnetwork] sputtering In and Pa

[Dave Zapotok]

Hi Jim,

I used to sputter Palladium often. Steer clear of Indium, it's along the lines of sputtering lead without the health concerns. It will make a nasty mess of the chamber. Indium is has a low vapor pressure and will destroy the vacuum. It is also a "soft metal" at room temperature. It will implant all over the chamber and subsequent runs will dislodge the implanted indium. This will cause re-deposit. Bad idea.

People often add palladium to gold to decrease grain size of the gold. It works great. No vapor pressure issues, no cross contamination problems.

Hope it helps.

Dave

David Zapotok
Regional Sales Manager, Northeast
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Phone: 617-794-7994
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From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Vlahakis, James
Sent: Wednesday, October 11, 2017 5:39 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] sputtering In and Pa

Hi everyone, one of our users would like to sputter materials that we are unfamiliar with, indium and palladium.

We are considering allowing these materials in our "dirty" sputter tool which has few material restrictions - Au, Ag, Al, Cu, Ge, ITO, Mg, Ni, Ti, Zn and fully cured polymers are allowed. For ITO and Mg we require the users to follow up with an Al sputter for encapsulation.

Your advice or comments would be much appreciated

Thanks

jim
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