[labnetwork] Helium leak rate on Oxford RIE

[Luciani, Vincent (Fed)]

Hello All,

Thanks for all the great feedback about the backside helium leak rate on the Oxford tools.  To sum up it sounds like most labs strive to keep it less than 10 sccm  and 6 -12 sccm is a typical range.  It is very helpful to see that what we observe is fairly typical.   We have one process that etches at -100 C with very high RF and ICP power that requires < 5 sccm.  We can get it there for this user but keeping it there is difficult.  For those who asked for the drawings of our modified quartz plate,  I will send that to you individually.   I plan to invest in some mechanical design engineering effort to make these cooled chucks perform better.  I'll share anything we come up with.

Thanks again,

Vince


Vincent K. Luciani
NanoFab Manager
Center for Nanoscale Science and Technology<http://www.cnst.nist.gov/>
National Institute of Standards and Technology
100 Bureau Drive, MS 6201
Gaithersburg, MD 20899-6200 USA
+1-301-975-2886




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