[labnetwork] Metallization on rough ceramic substrates

[Hitesh Kamble]

Hello Adithi,
 In case of HMDS ,it will improve adhesion but resists will not remove
easily from surafce.HMDS is mostly use in etching. Since you're having
rough surface, Instead of HMDS use LOR 3B or say liftOFF resists which
helps to improve liftoff process.
Also for 250nm metallization you need more than 2um thick resists.

We did not do this on ceramic samples exactly but successfully did liftoff
on etched/textured glass and etched samples(roughness more than~400nm).
Following are my suggestions:
-Time  Interval between litho and deposition should be lowest as possible
- Dehydration at higher temp and for longer time.
-LOR 3B coating at lower rpm and gradually increase rpm.
-Keep sample in Remover PG and heat at 80C for 5min or more if metal not
lifted,(Sonication not recquired in most cases)


Thanks,
Hitesh Kamble
IITBNF-IIT Bombay



On Fri 4 Jan, 2019, 6:08 PM ADITHI U <uadithi at iisc.ac.in wrote:

> Dear All,
>
>
>       We are having difficulties in doing metal(Ti/Pt) lift off on ceramic
> substrates. Does any of you have experience on fabricating metal patterns
> on the rough Ceramic Substrates. Below are the details of the process done.
>
>
>    The roughness of the ceramic substrates were approximately 400nm. We
> had used HMDS as adhesion promoter for lithography, the thickness of the
> Photoresist was ~ 1.5um.The thickness of the Ti/Pt layer was ~ 250nm.
> Immediately after lithography the deposition was done  followed by 48 hours
> of lift off(Acetone) process. Ultrasonication(5-10mins) in Acetone was done
> after 48hours.
>
>
> *Best Regards*
>
>
>
>
>
>
> *Adithi.USenior Facility Technologist,National Nano Fabrication Centre,CeNSE, Indian Institute of ScienceBangalore*
>
>
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20190104/d102e870/attachment.html>