[labnetwork] Dicing GaAs wafers

[Morrison, Richard H., Jr]

If your saw waste does not go to water treatment then you need to figure out how to trap the As in the water waste, most localities do not want that in the water. How waste goes to water treatment plant.

Rick


Richard H. Morrison
Principal Member of the Technical Staff
Draper
555 Technology Square
Cambridge, MA
02139-3573

Work  617-258-3420
Cell  508-930-3461
www.draper.com<http://www.draper.com>



From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Nibarger, John (Fed)
Sent: Wednesday, July 03, 2019 5:22 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Dicing GaAs wafers

Dear Colleagues,
We have some users who would like to use a dicing saw that is currently used to cut glass and sapphire to cut GaAs wafers as well. We’re worried about the safety aspects of both tool contamination and dealing with the waste water effluent. The dicing saw that we are using is a DISCO DAD3220. Does anyone have any thoughts or experience on this?
Thanks,
John

John P. Nibarger, Ph.D.
Manager, Boulder Micro-fabrication Facility
Microfabrication Group Leader (687.10)
National Institute of Standards and Technology
325 Broadway, MS 687.10
Boulder, CO  80305
303-497-4575 (phone)
303-497-3042 (fax)
john.nibarger at nist.gov<mailto:john.nibarger at nist.gov>

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