[labnetwork] Diced Samples Glued to UV Release Tape

[Siva Penmetsa]

Dear  Sa’ad,

I have faced similar issue few years back,
have tried different approaches like using UV exposure with mask
aligner(MJB3)
and with a direct UV bulb encased, varying exposure time and increasing the
distance between the UV bulb and sample helped.

You need to fine tune with the UV exposure dose(varying time or intensity,
high intensity UV bulb produces heat),
decreasing temperature of hotplate, and increasing sample distance from UV
source.

With Regards,
Siva Penmetsa,
Technology Manager,
Lithography and Dry Etch,
National Nano Fabrication Centre(NNfC),
Centre for Nano Science And Engineering(CeNSE),
Indian Institute of Science(IISc), Bangalore

On Fri, May 17, 2019 at 2:00 AM Hassan, Sa'ad <Sa'ad.Hassan at nrc-cnrc.gc.ca>
wrote:

> Hello All,
>
>
>
> As part of the last step of processing, I take wafers (Si and SiC), with
> photoresist on top,  dice them, die expand them on a hotplate at 55 degrees
> Celsius. And finally UV release the tape. I’ve noticed that sporadically,
> rather than the tape losing  adhesion, the opposite happens: the die end up
> cemented to the tape. Has anyone experienced anything like this before?
>
>
>
> Cheers,
>
> Sa’ad
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>



<siva at cense.iisc.ernet.in>
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