[labnetwork] Ion Milling

[Dennis Slafer]

Hi Steve and Mac,

Thanks for the quick response to Tom's question (and thanks Tom!).

We are trying to etch 18nm of Ni on a 4-in silicon wafer that has a polymer
mask to define the areas from which we want to remove the Ni.  The mask is
a UV-cured polymer, and I was also wondering if you have a feel for the
relative rates of removal of the Ni vs the polymer mask.

Much thanks in advance--Dennis






+++++++++++++++++

Hi Tom,

At Harvard, we have an ion beam etcher.  What is the material to be etched?


Mac

Mac Hathaway

Senior Process and Systems Engineer

Harvard Center for Nanoscale Systems

11 Oxford St.

Cambridge, MA  02138

617-495-9012

On Wed, May 22, 2019 at 4:18 PM Paolini, Steven <
spaolini at cns.fas.harvard.edu> wrote:

> We got one! Has Ar and O2 milling capability. Have him contact me.
>
>
>
> Steve Paolini
>
> Principal Equipment Engineer
>
> Harvard University Center for Nanoscale Systems
>
> 11 Oxford St.
>
> Cambridge, MA 02138
>
> 617- 496- 9816
>
> spaolini at cns.fas.harvard.edu
>
> www.cns.fas.harvard.edu
>
>
>
> *From:* labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> *On
> Behalf Of *Ferraguto, Thomas S
> *Sent:* Wednesday, May 22, 2019 11:47 AM
> *To:* 'labnetwork at mtl.mit.edu' <labnetwork at mtl.mit.edu>
> *Cc:* Dennis Work <dennis.slafer at microcontinuum.com>
> *Subject:* [labnetwork] Ion Milling
>
>
>
> Colleagues,
>
>
>
> I have a customer that needs dry etch 18nm. We can’t use our ICP for the
> process. Does anyone have an Ion Mill Tool that could provide him the
> service.
>
>
>
> Regards
>
>
>
> Tom Ferraguto
>


-- 
Dr. W. Dennis Slafer

President & CTO
MicroContinuum, Inc.
www.microcontinuum.com
57 Smith Place
Cambridge, MA 02138

o: 617.354.1092
c: 781.635.7032
f: 617.354.1107
dennis.slafer at microcontinuum.com
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