[labnetwork] Ion Milling

[Youry Borisenkov]

Hi,

Usually a good guess would be 1:1 ratio. Metalls are usually etched faster,
in IBM, than resists. However, an important issue is the lateral
dimensions, if they are smaller than 100nm you will get a redeposition
issues. You will get Nickel on your resist sidewalls.

Regards,
Youry

On Wed, May 22, 2019, 23:20 Ferraguto, Thomas S <Thomas_Ferraguto at uml.edu>
wrote:

> Colleagues,
>
>
>
> I have a customer that needs dry etch 18nm. We can’t use our ICP for the
> process. Does anyone have an Ion Mill Tool that could provide him the
> service.
>
>
>
> Regards
>
>
>
> Tom Ferraguto
> _______________________________________________
> labnetwork mailing list
> labnetwork at mtl.mit.edu
> https://mtl.mit.edu/mailman/listinfo.cgi/labnetwork
>
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20190523/504d182c/attachment.html>