[labnetwork] Sloped Sidewalls for Photoresist

[Robert MacDonald]

In a stepper I would say run a focus expose matrix. In your case start by changing the dose. In the image it looked like you had not reveled the Si.  So a higher dose would be a start.  But I do not know your resist. 

In general, it will be hard to make sub micron line space features with your contact aligner. Can you access a stepper?  

Thanks,

Rob 

Sent from my iDidntspellcheckit

> On Dec 17, 2020, at 11:07 AM, Sa'ad H <saad_m_hassan at hotmail.com> wrote:
> 
> Good Morning Everyone,
> 
> I trust everyone is well. I have been working on defining lithographic features that are lines separated by trenches both of which are 800nm wide. 
> 
> I am getting adequate resolution, i.e, the lines are very close to spec. But the sidewalls slope significantly as can be seen in the attached picture.
> 
> My wafer is fabricated as follows:
>  Bare Silicon Wafer
> HMDS
> Backside Antireflective Coating (XHiRC-16)
> SPR-955 - 6000 rpm spin - PR thickness - 800nm
> Bake 90 Celsius for 90 seconds
> Exposure - 125 mJ/cm2 in a contact aligner
> Development 1 minute with ultrasonic
> 
> 
> 
> <image.png>
> 
> 
> Does anyone know how I can achieve nice vertical sidewalls? 
> 
> 
> Cheers,
> Sa'ad
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