[labnetwork] Dicing glass/quartz or alumina with Disco DAD3240 saw

[Miller, Suzanne]

Are you cutting in slices?  I would only cut 100 to 150 microns per slice.  I would use a Diamond grit of at least 46 microns and 8 mil thick. Suzanne

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From: labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Beaudoin, Mario <beaudoin at physics.ubc.ca>
Sent: Thursday, September 9, 2021 3:52:38 PM
To: labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>; Blednov, Andrey <andrey.blednov at ubc.ca>
Subject: [labnetwork] Dicing glass/quartz or alumina with Disco DAD3240 saw

We are having issues with cutting glass/quartz or alumina wafers with our Disco DAD3240 dicing saw

We’re using composite Thermocarbon blades @ 20K rpm and tried feed speeds ranging between 0.5-5 mm/sec. Sample thickness varies but even for thinner ones (500-700 um) we’re having a problem that the blade breaks. Looks like the blade trajectory is bending during the cut and this causes catastrophic damage to the blade. Why this bending occurs is not clear. Maybe the problem is in the blue tape we use to secure samples, but we don’t observe any apparent displacement of the sample on the film.

Anyone else having similar issues?  Any suggestions?

Regards,

Mario

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[cid:part1.7D57B750.7039D763 at physics.ubc.ca]
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