[labnetwork] Dicing glass/quartz or alumina with Disco DAD3240 saw

[Beaudoin, Mario]

We are having issues with cutting glass/quartz or alumina wafers with 
our Disco DAD3240 dicing saw

We’re using composite Thermocarbon blades @ 20K rpm and tried feed 
speeds ranging between 0.5-5 mm/sec. Sample thickness varies but even 
for thinner ones (500-700 um) we’re having a problem that the blade 
breaks. Looks like the blade trajectory is bending during the cut and 
this causes catastrophic damage to the blade. Why this bending occurs is 
not clear. Maybe the problem is in the blue tape we use to secure 
samples, but we don’t observe any apparent displacement of the sample on 
the film.

Anyone else having similar issues?  Any suggestions?

Regards,

Mario

-- 
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20210909/65ddcf5c/attachment.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: Mario Beaudoin SBQMI sig 2.jpg
Type: image/jpeg
Size: 21446 bytes
Desc: not available
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20210909/65ddcf5c/attachment.jpg>