[labnetwork] RIE through Silicon

[Morrison, Richard H., Jr]

We sputter or evaporate a thick layer of Al on the wafer backside 3um it works as an etch stop then you remove it with Al etch.

Richard Morrison
PMTS
Draper Laboratory
555 Technology Square
Cambridge Ma  02139
Office: 617-258-3420
Cell: 508-930-3461





From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Jeremy Upham
Sent: Monday, April 11, 2022 11:08 PM
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] RIE through Silicon

I think your plan could work, so I'm not sure that I see the problem

In my experience the carbon in the PR can contribute to the plasma chemistry and affect the etch, so I tend to use vacuum grease as a thermally conducting binder between the etched sample and the backing wafer instead. Though your system may well work for your recipe.

Hope that helps,

Jer Upham PhD
Senior Lab Manager / Research Scientist
Quantum Photonics Group
University of Ottawa
Tel.: 1 (613) 562-5800 ext 7325


On Mon, Apr 11, 2022 at 6:54 PM Chang, Long <lvchang at central.uh.edu<mailto:lvchang at central.uh.edu>> wrote:
Attention : courriel externe | external email
Hi Guys,

I have an Oxford RIE with backside Helium. I want to etch through the silicon wafer (380um thick). The largest pattern is a 1mm diameter circle. My plan is to ride the 4” sample wafer on a 4" carrier wafer with PR. Does anyone have a good solution to this problem?

Thanks,
Long

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