[labnetwork] Oxford Wafer Jam/Break

[Paolini, Steven]

Long,
  You should have an at least 3mm exclusion ring of no PR around the circumference of the wafer. It is also helpful to run the wafer through an EBR step before processing it.
Equipment dood

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu
www.cns.fas.harvard.edu

From: labnetwork <labnetwork-bounces at mtl.mit.edu> On Behalf Of Chang, Long
Sent: Tuesday, June 21, 2022 2:51 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Oxford Wafer Jam/Break

Hi Guys,

After etching through 380um of Silicon, the loading arm would get jammed during unloading, see photo. The problem was fixed by adding a 15min step to do nothing step to allow the clamp to cool down before unloading. Now the problem is back and the plan is to increase the cool down time until it stops jamming. Is there a better way to avoid this problem? Should the PR on the wafer edge be removed?

Thanks,
Long
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