[labnetwork] Dicing sapphire wafer

[Deng, Jiangdong]

1mm/s is too fast for sapphire. Typically we use 0.1 or 0.2 mm/s and 20k RPM. Blade thickness should be 0.3 mm ( no thinner than 0.2 mm). Please also check the disco service, and they usually will give you very good suggestions. 

-JD @ CNS of Harvard 

Sent from my iPhone

> On Jul 14, 2023, at 7:55 PM, Ningzhi Xie <nzxie at uw.edu> wrote:
> 
> 
> Dear College,
> 
> I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice a 460μm sapphire (Al2O3) wafer. It seems the wafer is too hard that I get into trouble of frequently breaking the dicing blade. I have tried lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into half of the wafer (230μm) but still got the blade broken. I am wondering if you have any good suggestions on sapphire wafer dicing.
> 
> Thank you very much.
> 
> Best regards,
> Ningzhi Xie
> Department of Electrical and Computer Engineering
> University of Washington
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