[labnetwork] Dicing sapphire wafer

[Christophe Clément]

Hi Ningzhi 
We dice sapphire wafer at Poly using a resinoid blade, grit size of 45 microns minimum (sometime 75 microns), cutting speed lower than your at 0.4 mm/s, spindle speed at 22 KRPM and we don't have issue. 
Sample thickness is the same as yours, and we cut it in one pass. 

Hope this help 
Best 
Chris 



Christophe Clément 

Technicien laboratoire 

Laboratoire de microfabrication (LMF) 

Groupe des Couches Minces (GCM) [ http://www.gcmlab.ca/ | www.gcmlab.ca ] 


Ecole Polytechnique de Montréal [ http://www.polymtl.ca/ | www.polymtl.ca ] 


Département de génie physique 

* 2900 Boulevard Edouard Monpetit 

Pavillon JAB 
Campus de l'Université de Montréal 
Montréal (Québec) H3T 1J4 


8 [ mailto:christophe.clement at polymtl.ca | christophe.clement at polymtl.ca ] 


( 514 340 4711 #2417 

Fax : 514 340 5195 






De: "Ningzhi Xie" <nzxie at uw.edu> 
À: labnetwork at mtl.mit.edu 
Envoyé: Vendredi 14 Juillet 2023 19:08:20 
Objet: [labnetwork] Dicing sapphire wafer 

Dear College, 
I am using the DISCO DAD 321 Wafer Dicing Saw and VT07 SD400 blade to dice a 460μm sapphire (Al2O3) wafer. It seems the wafer is too hard that I get into trouble of frequently breaking the dicing blade. I have tried lowing the spin speed to 12000rpm, the cutting speed to 1mm/s, and only cut into half of the wafer (230μm) but still got the blade broken. I am wondering if you have any good suggestions on sapphire wafer dicing. 

Thank you very much. 

Best regards, 
Ningzhi Xie 
Department of Electrical and Computer Engineering 
University of Washington 

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