[labnetwork] PZT Etch- RIE selectivity between PZT and Pt

[Goutam Prakash]

Lab Network,

I have a Sputtered PZT film on a seed layer/ bottom electrode of ~200nm Sputtered Pt (on thermal SiO2/ SOI- substrate). Any idea if I can use the Pt surface as an etch stop while using Ar (physical etch) in RIE?
In previous such devices involving this process, I have had difficulty wire bonding this Pt surface. Is it possible the Pt has eroded too much for wire bonding?

Does anyone have the etch selectivity data between sputtered PZT vs. Pt for Ar-RIE?

I have a PR mask of AZ4562 (~6um thickness).

Thank you!
--
Goutam P (Process Integration Engineer),
National Nano-fabrication Centre (NNfC),
Centre for Nano Science and Engineering (CeNSE),
Indian Institute of Science (IISc.), Bengaluru-560012


-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20230927/aedfd8d5/attachment.html>