[labnetwork] Experience with 200 mm Cu Electroplating Tools for RDL?

[James Grant]

Dear Labnetwork colleagues,

I'm looking for some collective wisdom on Cu electroplating at 200 mm wafer level, specifically for redistribution layer (RDL) processes. I've never done electroplating so fully aware of potential of falling into unforeseen potholes! Been told we would be doing ~ 2 wafers/week so not at all high throughput.

We are currently looking at two vendors:


  *   Technic: Semcon 1000
  *   ClassOne: Solstice LT3

If you have experience with either of these tools (or similar 200 mm Cu plating systems), I'd really appreciate any feedback on:


  *   Process capability for fine-pitch RDL (uniformity, throwing power, defectivity, edge exclusion)
  *   Reliability, ease of maintenance, and real-world operator workload.
  *   Bath management / additive control and any pitfalls or "gotchas". We have limited staff and bath maintenance is one of the areas that I think could be a real time sink.
  *   Integration issues (facility requirements, exhaust, waste handling, software, training, etc.)
  *   Anything you would do differently if you were specifying again

Off-list replies are also very welcome if you'd prefer not to comment on a public thread; I'm happy to summarise anonymised feedback back to the list if that's useful.

Many thanks in advance for any insights you can share.

Best wishes,
James
Dr. James Paul Grant
JWNC Head of Engineering and Process
Engineering and Process Team
james.grant at glasgow.ac.uk<mailto:james.grant at glasgow.ac.uk>
  [cid:image001.png at 01DC6443.E28F70B0]
      www.JWNC.gla.ac.uk<http://www.jwnc.gla.ac.uk/>
[cid:image002.jpg at 01DC6443.E28F70B0]  LinkedIn.com/company/JWNC
[cid:image003.jpg at 01DC6443.E28F70B0]  @UofG_JWNC<https://twitter.com/uofg_jwnc>
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20251203/32a322d2/attachment.html>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: image001.png
Type: image/png
Size: 26666 bytes
Desc: image001.png
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20251203/32a322d2/attachment.png>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: image002.jpg
Type: image/jpeg
Size: 725 bytes
Desc: image002.jpg
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20251203/32a322d2/attachment.jpg>
-------------- next part --------------
A non-text attachment was scrubbed...
Name: image003.jpg
Type: image/jpeg
Size: 724 bytes
Desc: image003.jpg
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20251203/32a322d2/attachment-0001.jpg>