[labnetwork] Copper Through-Glass Vias on fused silica

[Hess, Larry A. (GSFC-5530)]

Hi,
I am looking for a (hopefully established) source to deposit ALD copper on Though-Glass Vias.
The vias are about 20um in diameter with an aspect ratio of about 10:1.
I would also consider Cu electroplating( after an appropriate ALD adhesion/base layer), but I'm not sure how feasible that is given the via diameter and aspect ratio.

Thanks for your help!

Larry

Larry A. Hess, PhD
NASA
Goddard Space Flight Center
8800 Greenbelt Road
Code 553, Detector Systems Branch
Building 11, Room E011
Greenbelt, MD 20771
301-286-0259 (P)
301-286-1672 (F)

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