[labnetwork] Issue Striking Plasma for NiFe Sputtering on Angstrom Nexdep PVD System – Need Guidance

[Martin, Michael]

Hi Pial,
    Here's some tricks we use to get a plasma lit. 1) With your shutters closed raise the pressure until you get a plasma and then drop down to your target 2) If you have substrate sputtering (usually RF) turn that on at the same time just to get some ions in there 3) Run a second target with substrate shutters closed until it lights.  We do Ni pretty regularly with a similar thickness target but have not done NiFe.

-Michael
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From: labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Mohammad Mohtasim Hamid Pial <mpial001 at fiu.edu>
Sent: Monday, October 13, 2025 4:32 PM
To: labnetwork at mtl.mit.edu <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Issue Striking Plasma for NiFe Sputtering on Angstrom Nexdep PVD System – Need Guidance


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Dear All,

I am attempting to deposit NiFe using a magnetron sputtering setup (Angstrom Engineering – Nexdep PVD platform). Below are my target specifications and sputtering parameters:

Target: NiFe (2" dia × 1 mm, 4N purity) bonded to a 1/8" Cu backing plate
Sputtering Method: DC Magnetron Sputtering
DC Power: 100–150 W
Base Pressure: ~10⁻⁶ Torr
Ar Gas Flow Rate: 20–30 sccm
Working Pressure: 3–5 mTorr

However, I am unable to ignite the plasma. The DC power supply setpoint keeps blinking and the power stalls around 15 W before dropping

Could this issue be due to insufficient magnetic field strength (not penetrating the thick target/Cu backing), or is the target too thick for effective plasma ignition? Do I need a thinner target or additional magnetic confinement?

I would greatly appreciate any insights or recommendations from anyone who has sputtered NiFe or similar high-permeability alloys on this platform.

Thank you in advance!
Pial


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