[labnetwork] Issue Striking Plasma for NiFe Sputtering on Angstrom Nexdep PVD System – Need Guidance

[Philipp Altpeter]

Hello Pial,

Sounds like a problem of the thickness of the target. Typically a cylindrical shield surrounds the target and must be electrically isolated from it. Make sure the cylinder does not contact the target - you can verify proper isolation with a multimeter.

If the cylinder is a screw-on cap, place a temporary spacer (for example, a small piece of Teflon sheet) between the cap edge and the target when tightening to ensure a sufficient gap. Remove the spacer after you’ve adjusted the fit.

I hope it helps.

Philipp

14.10.2025 04:34:37 Mohammad Mohtasim Hamid Pial <mpial001 at fiu.edu>:

> Dear All,
> 
> I am attempting to deposit NiFe using a magnetron sputtering setup (Angstrom Engineering – Nexdep PVD platform). Below are my target specifications and sputtering parameters:
> 
> Target: NiFe (2" dia × 1 mm, 4N purity) bonded to a 1/8" Cu backing plate
> Sputtering Method: DC Magnetron Sputtering
> DC Power: 100–150 W
> Base Pressure: ~10⁻⁶ Torr
> Ar Gas Flow Rate: 20–30 sccm
> Working Pressure: 3–5 mTorr
> 
> However, I am unable to ignite the plasma. The DC power supply setpoint keeps blinking and the power stalls around 15 W before dropping 
> 
> Could this issue be due to insufficient magnetic field strength (not penetrating the thick target/Cu backing), or is the target too thick for effective plasma ignition? Do I need a thinner target or additional magnetic confinement?
> 
> I would greatly appreciate any insights or recommendations from anyone who has sputtered NiFe or similar high-permeability alloys on this platform.
> 
> Thank you in advance!
> Pial
> 
> 
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