[labnetwork] PCB in e-beam evaporator?

[Martin, Michael]

Hi Russ,
    You might try giving the pads on the PCB a thorough cleaning in O2 plasma in case they may have some organic schmutz on them.

-Michael
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From: labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Russ Renzas <rrenzas at unr.edu>
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Subject: [labnetwork] PCB in e-beam evaporator?


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For a summer lab class we're trying to have students make a chip and wirebond it to a PCB. We're having trouble wirebonding to the immersion gold pads though.

Is it okay to put pcbs in our ebeam evaporator to evaporate Au?

We tried a small piece in a Au SEM prep sputter coater and that worked but it's too small for the class PCBs.

Thanks, also appreciate any tips on how to spec pcb metalization for wirebonding compatibility. We have both Al ultrasonic wedge and Au ball bond capabilities.

Russ Renzas
University of Nevada, Reno
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