[labnetwork] Sputter conditions for XPS samples?

[Beaudoin, Mario]

Big thanks to all who responded.

Mario

On 5/27/2026 6:20 AM, Mark Hofheins wrote:
> [*CAUTION:* Non-UBC Email]
>
> Good Morning Mario,
>
> We will flow 13sccms to 20sccms of Ar during our sputter.
> Optimum vacuum pressure for us is 3 millitorr.
> Power will depend on what type of material the target is made of and
> How much deposition you require/per time.
>
> Best regards,
>
> Mark Hofheins
>
> ^*
> *
>
>
> mhofheins at unm.edu <mailto:mhofheins at unm.edu>
>
> Cell 505-259-9278
>
> Office 505-272-7506
>
> Micro Electronics Technician &
>
>  Safety Coordinator MTTC
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> University of New Mexico
>
> 800 Bradbury S.E.  Suit 169
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>
> ------------------------------------------------------------------------
> *From:* labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of 
> Beaudoin, Mario <beaudoin at physics.ubc.ca>
> *Sent:* Tuesday, May 26, 2026 5:57 PM
> *To:* 'labnetwork at mtl.mit.edu' <labnetwork at mtl.mit.edu>
> *Subject:* [labnetwork] Sputter conditions for XPS samples?
>
> *  [EXTERNAL]*
>
> **
>
> Dear Network,
>
> We have inherited an old XPS machine.  The XPS part works fine and we 
> know how to acquire data.  For analysis, we will certainly consult 
> experts before publishing as we are aware of the potential pitfalls.
>
> We also have an Argon source and sputter power supply and we would 
> like to sputter our sample surfaces to remove surface contaminants.  
> The problem: we are neophytes at that part of the process besides 
> operating the cylinder and leak valve.
>
> My question: What are the typical Ar pressures and power settings 
> generally used for sputtering?
>
> Please respond privately or through the network.
>
> Big THANK YOU.
>
> Mario
>
> -- 
-- 
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