[labnetwork] Sputter conditions for XPS samples?

[Oncel, Nuri]

Hi, Mario,

Ours is a fairly old system as well (PHI 5400). You can control the sputtering rate by adjusting the background pressure, beam voltage, and ion beam current.
We typically backfill the chamber with argon to around (10^{-7}) mbar. The beam voltage can range from 1 kV to 5 kV.
RBD Instruments used to provide free manuals and “how-to” documents, which may still be useful resources.
If you have any questions, feel free to send me a private email. We can also discuss it over Zoom, if you prefer.
Best

Nuri




Professor Nuri Oncel, Ph.D.

Director of UND-NanoFoundry<https://www.und.edu/Nanofoundry>

Department of Physics and Astrophysics

University of North Dakota

https://sites.google.com/view/oncel-research-group/group



________________________________
From: labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Mark Hofheins <mhofheins at unm.edu>
Sent: Wednesday, May 27, 2026 8:20 AM
To: Beaudoin, Mario <beaudoin at physics.ubc.ca>; 'labnetwork at mtl.mit.edu' <labnetwork at mtl.mit.edu>
Subject: Re: [labnetwork] Sputter conditions for XPS samples?

Good Morning Mario,

We will flow 13sccms to 20sccms of Ar during our sputter.
Optimum vacuum pressure for us is 3 millitorr.
Power will depend on what type of material the target is made of and
How much deposition you require/per time.

Best regards,

Mark Hofheins



mhofheins at unm.edu<mailto:mhofheins at unm.edu>

Cell  505-259-9278

Office 505-272-7506



Micro Electronics Technician &

 Safety Coordinator MTTC

Manufacturing Engineering/

School of Engineering

Science and Technology park

University of New Mexico

800 Bradbury S.E.  Suit 169

Albuquerque, New Mexico

87106-4346


________________________________
From: labnetwork <labnetwork-bounces at mtl.mit.edu> on behalf of Beaudoin, Mario <beaudoin at physics.ubc.ca>
Sent: Tuesday, May 26, 2026 5:57 PM
To: 'labnetwork at mtl.mit.edu' <labnetwork at mtl.mit.edu>
Subject: [labnetwork] Sputter conditions for XPS samples?


  [EXTERNAL]

Dear Network,

We have inherited an old XPS machine.  The XPS part works fine and we know how to acquire data.  For analysis, we will certainly consult experts before publishing as we are aware of the potential pitfalls.

We also have an Argon source and sputter power supply and we would like to sputter our sample surfaces to remove surface contaminants.  The problem: we are neophytes at that part of the process besides operating the cylinder and leak valve.

My question: What are the typical Ar pressures and power settings generally used for sputtering?

Please respond privately or through the network.

Big THANK YOU.

Mario

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