[labnetwork] Metal Targets Final thickness

[Morrison, Richard H., Jr.]

At Draper we do the following:

Take a surface profile of the target during installation, note target material thickness.
Keep a log of voltage and current for every run (DC Mag only)
As the target depth changes the voltage on the target compensates to keep the current set.
One per qtr we open the tool and do a surface profile and estimate the physical thickness left.
If you have been logging your deposition runs and thickness you can then estimate how many depositions you have left.

It is always best to pull the target early, because if you break through you sputter the bonding agent all over the chamber and your wafers and then you have a big mess to cleanup. Most bonding agents are indium based and that it tough to cleanup.

Hope this helps,

Rick


Draper Laboratory
Principal  Member of the Technical Staff
Group Leader Microfabrication Operations
555 Technology Square
Cambridge Ma, 02139-3563

www.draper.com
rmorrison at draper.com
W 617-258-3420
C 508-930-3461




From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Kamal Yadav
Sent: Friday, October 17, 2014 7:37 AM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Metal Targets Final thickness

Dear All,

Please let me know how do you know when you need to replace your metal targets in a sputtering system. In a recent incident, we went little too far may be and the back material [Cu] got sputtered and contaminated the chamber. We have 4" and 2" round targets where a inner ring forms, which is the thinnest.

If you follow any policy or methodology that would be great to know.

--
Thanks,
Kamal Yadav
Sr. Process Technologist
IITBNF, EE Department, Annexe,
IIT Bombay, Powai
Mumbai 400076
Internal: 4435
Cell: 7506144798
Email: kamal.yadav at gmail.com<mailto:kamal.yadav at gmail.com>, kamalyadav at ee.iitb.ac.in<mailto:kamalyadav at ee.iitb.ac.in>
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