[labnetwork] NiFe 81-19 Sputtering Request

[Hal Romans]

Hi Michael -Are you sure your gun is correctly setup to sputter magnetic materials? This usually requires removing or changing the polarity of a permanent magnet(s). With our PVD 75 at the University of Illinois, we only RF sputtered oxides so I never had to worry about this there and couldn't tell you exactly what needs to be done.
Also, I've found the Lesker shield (outer, ground electrode) to be very flimsy and susceptible to distortion due to heating - especially the ring on top that sets the gap between the outer electrode and the target hold down ring. I would purchase some of these to have on hand anyway.

Also check to make sure everything is very clean. One critical point is the top ring mentioned above. The other being where the outer electrode attaches to the gun at the bottom. These screws not only set the gap between the two electrodes but complete the ground path.         Also make sure there are no high spots on the pan head screws that hold down the target. The flat tip screwdriver slot is easy to get buggered up. Buy some spares of these also. 
Also make sure there are no high spots on your target (from arcing, etc.).
Finally, I would sometimes have to "cheat" to increase the gap between the two electrodes. When installing the outer electrode, don't allow the slot in the can to fully fall onto the attachment screw. Just make sure this is done evenly on all slots so the gap between the electrodes is uniform. You may want to try this early in your troubleshooting to confirm the problem is a spacing issue between electrodes. If it is the problem, you may decide to complete your urgent deposition before fixing the underlying problem. 
Good luck,
J. Hal Romans Senior Equipment Engineer University of California San Diegohromans at ucsd.edu

      From: Michael Khbeis <khbeis at uw.edu>
 To: labnetwork at mtl.mit.edu 
 Sent: Saturday, June 18, 2016 9:39 PM
 Subject: [labnetwork] NiFe 81-19 Sputtering Request
   
Dear Colleagues
We have an issue sputtering NiFe in our Lesker PVD75. The target runs fine for burn-in and a few runs but then can't maintain a plasma (DC 800W). 
Does anyone have an idea what causes relatively rapid failure in maintaining plasma with this specific material? I doubt the target is worn that fast. 
Also, we have a client that urgently needs some depositions. Is there a site willing to take on the task while we troubleshoot our system?
Gratefully,

Dr. Michael KhbeisWashington Nanofab Facility
University of Washington
Fluke Hall, Box 352143
(O) 206.543.5101
(C) 443.254.5192
khbeis at uw.edu
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