[labnetwork] Project Feasibility for RIE

[Robert Hower]

I agree with Vince on the contamination of the vacuum plasma chamber. In
addition to just the volatile components, how pure were the components
prior to mixing? You may have other metals/ions in the material, that could
contaminate your chamber, and cause changes in the plasma.

Rob

On Mon, Oct 17, 2016 at 10:59 AM, Luciani, Vincent (Fed) <
Vincent.Luciani at nist.gov> wrote:

> Hello,
>
>
>
> I checked with our RIE chemist.  He does not have direct experience with
> these chemicals but offered the following comments.
>
>
>
> Based on the formula, the film is a solid polymer
> (CH2CHCO(C2H4O)nCOOCHCH2) blended with the ionic liquids (C8H15BF4N2+
> AgBF4+ C10H12O2) inside. It is a Carbon based film, so normal Oxygen plasma
> should etch it. The concern is if the small molecular organic compounds
> (C8H15BF4N2 and C10H12O2) will vaporize inside the high vacuum plasma
> chamber which may change the electrolyte chemical composition and
> contaminate the plasma system.
>
>
>
> Best,
>
> Vince Luciani
>
>
>
>
>
> Vincent K. Luciani
>
> NanoFab Manager
>
> Center for Nanoscale Science and Technology <http://www.cnst.nist.gov/>
>
> National Institute of Standards and Technology
>
> 100 Bureau Drive, MS 6201
>
> Gaithersburg, MD 20899-6200 USA
>
> +1-301-975-2886
>
>
>
>
>
>
>
>
>
> *From:* labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces@
> mtl.mit.edu] *On Behalf Of *Abelev, Esta
> *Sent:* Thursday, October 13, 2016 12:53 PM
> *To:* labnetwork at mtl.mit.edu
> *Subject:* [labnetwork] Project Feasibility for RIE
>
>
>
> Hi,
>
>
>
> I would like to introduce myself, I am Esta Abelev a Technical Director of
> Nanoscale Fabrication facility at University of Pittsburgh.
>
> Recently, I received request to etch following materials (see below
> table), that I have never worked with. I wanted to ask the community if
> somebody have an experience with those materials and how the best way to
> etch it.
>
>
>
> Need to etch the polymer electrolyte (salt concentration is 2.5 mM based
> on the volume of Ionic liquid. And PEGDA/IL is 60/40 wt.%) on the silicon
> substrate except those areas protected by metal. The chemical formulas for
> these materials are as follows:
>
> *Name *
>
> *Chemical Formula*
>
> Polyethylene glycol dicrylate
>
> CH2CHCO(C2H4O)nCOOCHCH2
>
> 1-butyl-3-methylimiadazolium tetrafluoroborate
>
> C8H15BF4N2
>
> Silver tetrafluoroborate
>
> AgBF4
>
> 2-Hydroxy-2-methylpropiophenone
>
> C10H12O2
>
>
>
> Thank you, Esta
>
>
>
> …………………………………………………………………………………………………………………………………………………………………..
>
> Dr. Esta Abelev
>
>
>
> Technical Director of PINSE/NFCF
>
> *Petersen Institute of NanoScience and Engineering (PINSE)*
>
> *Nanoscale Fabrication and Characterization Facility (NFCF
> <http://www.nano.pitt.edu/facilities>)*
>
> University of Pittsburgh
>
> 636 Benedum Hall
>
> 3700 O’Hara Street
>
> Pittsburgh, PA 15261
>
>
>
> Phone: 412-383-4096
>
> Email: eabelev at pitt.edu
>
> Office: M104 Benedum Hall
>
> http://www.nano.pitt.edu
>
>
>
>
>
> _______________________________________________
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>
>


-- 
Robert W. Hower, Ph.D.
The University of Michigan, Lurie Nanofabrication Facility
1301 Beal Ave, 1234A EECS
Ann Arbor, MI 48109
734-827-4370
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