[labnetwork] Etching Alumina (ALD) using BCl3
Tony Whipple
whipp003 at umn.edu
Tue Apr 18 12:48:29 EDT 2017
Hello Aji;
We etch ALD Alumina film with our Oxford system which is patterned by
resist.
Since most our films are thin we do not have much problem with
selectivity to resist
which is about 1:1 for those films.
The recipe we use is:
BCl3 30 sccm
ICP 625 W
RF 50 W
2 mtorr
We get ~ 650 Ang/ min rate for both the Alumina film and resist. The
recipe has not
been optimized but should be. One of the items that we should work on is
to have
the recipe etch slower. Our users have said it etches too fast. We have
since looked at
reducing the RF platten /chuck power while keeping the ICP power the
same and this
helps in lowering the etch rate.
Regards, Tony W.
On 4/18/2017 9:54 AM, Jugessur, Aju S wrote:
>
> Hi,
>
> Can anyone offer some advice on Alumina etch?
>
> We do have BCl3/Cl2/O2 etch on our Oxford PlasmaPro.
> We plan to use S1818 as the mask as we intend etching less than 30 nm
> of the Alumina: will this work? I am not sure what is the etch
> selectivity.
> We may also use an intermediate metal mask. I am aware that ChF3 and
> C4F8 also etches Alumina.
>
> Can anyone advise us on this process and a benchmark recipe will help?
>
> Also, the tool is currently used for III-V etching. Can we safely use
> the tool to etch Alumina without the risk of process contamination,
> assuming we do a clean up step each time?
>
> Thanks
> Regards
> Aju
>
>
>
> Aju Jugessur /Ph.D./
> Director, University of Iowa Microfabrication Facility
> Professor (Adj.), Physics and Astronomy
> OSTC, Iowa Advanced Technology Labs
> University of Iowa
>
> 205 N. Madison St
> Iowa City, IA 52242
> 319 -353-2342
> aju-jugessur at uiowa.edu
> http://ostc.uiowa.edu/uimf
>
>
>
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