[labnetwork] Dicing tool, saw or diamond scribe & break? Producers?

[Paolini, Steven]

Svenn,
  I must agree with Mr. Clay’s choices in scribing/dicing equipment. I do have one concern though; when harvesting die from a toxic compound such as GaAs, sawing the wafer will put toxins into the water stream therefore scribing/breaking is the preferred method.

Steve Paolini
Principal Equipment Engineer
Harvard University Center for Nanoscale Systems
11 Oxford St.
Cambridge, MA 02138
617- 496- 9816
spaolini at cns.fas.harvard.edu
www.cns.fas.harvard.edu

From: labnetwork-bounces at mtl.mit.edu [mailto:labnetwork-bounces at mtl.mit.edu] On Behalf Of Noah Clay
Sent: Tuesday, September 05, 2017 6:05 PM
To: Svenn Ove Linde
Cc: labnetwork at mtl.mit.edu
Subject: Re: [labnetwork] Dicing tool, saw or diamond scribe & break? Producers?

Svenn,

For scribing/notching, have a look at the Optophase MR 200:

http://www.optophase.com/Brochure/OEG/mr200_en_web.pdf<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.optophase.com_Brochure_OEG_mr200-5Fen-5Fweb.pdf&d=DwMFaQ&c=WO-RGvefibhHBZq3fL85hQ&r=-H4Z_jeDfTYjnKPXor15vLwzBllmg8gFrb9m_k9OGks&m=cJHFZ3UBE6vSC9RsvTYCJ5Pj11cW_ts5rvt0enn30Ko&s=DkQq6bFZTIrbtnDdfgTo4XH7QCZ_r_mbDtLSiNn2cik&e=>

Loomis’ LSD-100 has also been a workhorse scribing/notching system:

http://www.loomisinc.com/downloads_www/Loomis_LSD-100_breaking.pdf<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.loomisinc.com_downloads-5Fwww_Loomis-5FLSD-2D100-5Fbreaking.pdf&d=DwMFaQ&c=WO-RGvefibhHBZq3fL85hQ&r=-H4Z_jeDfTYjnKPXor15vLwzBllmg8gFrb9m_k9OGks&m=cJHFZ3UBE6vSC9RsvTYCJ5Pj11cW_ts5rvt0enn30Ko&s=RSyVae6xaqniKeEp0PB5y6vzmRr3_9eBcIsldUMlddg&e=>

For wafer dicing, we use an ADT 7122:

http://www.adt-co.com/ADT2014/userdata/SendFile.asp?DBID=1&LNGID=1&GID=626<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.adt-2Dco.com_ADT2014_userdata_SendFile.asp-3FDBID-3D1-26LNGID-3D1-26GID-3D626&d=DwMFaQ&c=WO-RGvefibhHBZq3fL85hQ&r=-H4Z_jeDfTYjnKPXor15vLwzBllmg8gFrb9m_k9OGks&m=cJHFZ3UBE6vSC9RsvTYCJ5Pj11cW_ts5rvt0enn30Ko&s=Ev-jQiL7OK-VEnlpc_XNTkkF-Q-eiRZDkIPzOhB3sw8&e=>

Thank you,
Noah Clay

Noah Clay
Director, Quattrone Nanofabrication Facility
School of Engineering & Applied Science
University of Pennsylvania
Philadelphia, PA

(215) 898-9308
nclay at upenn.edu<mailto:nclay at upenn.edu>

On Sep 5, 2017, at 5:07 AM, Svenn Ove Linde <svenn.linde at ntnu.no<mailto:svenn.linde at ntnu.no>> wrote:

Dear Colleagues
We consider purchasing a new dicing tool.
Today we have a Disco saw “DAD-2H/6” (1984) and a Dynatex “DX-III” (1993) diamond scribe and break system.
Approximately 95% of the dicing processing today is completed with the Dynatex diamond scriber.
Typical sample and material information
Wafer Substrate Material
GaAs, SiO2, Sapphire, Si3N4, Glass, steel alloy (only scribe), Quartz
Substrates dominant: Si
Wafer Thickness:
200 micrometer – 550 micrometer (Some samples down to 100 micrometer)
Glass slides up to 1mm (rarely).
Crystal Orientation:
For Si mostly (100) but also (111)
Any “Sensitive Material” in the street:
Si nano- and microwires.
“Front side” Surface Coatings:
Nitride, oxide, common metals <1µm
“Back side” Surface Coatings:
Nitride, oxide, common metals <1µm
Wafer or Sample Dimensions:
Wafers (2” - 6”) and pieces/different shapes of wafers, like square 1x1 cm.

I want to check if any of you have recommendations whether we should go for a saw or a diamond scriber.
We are also interested in producers of this equipment.
Thanks in advance.

Best regards,
Svenn Ove Linde
NTNU - Norwegian University of Science and Technology
Faculty of Natural Sciences, NanoLab
Sem Sælandsvei 14
NO-7491 Trondheim, Norway

Homepage:  www.ntnu.no/nanolab<https://urldefense.proofpoint.com/v2/url?u=http-3A__www.ntnu.no_nanolab&d=DwMFaQ&c=WO-RGvefibhHBZq3fL85hQ&r=-H4Z_jeDfTYjnKPXor15vLwzBllmg8gFrb9m_k9OGks&m=cJHFZ3UBE6vSC9RsvTYCJ5Pj11cW_ts5rvt0enn30Ko&s=r4l5lY77L0m5xwi16jiAEO8H6aGPXv65J79f76zxDG0&e=>

_______________________________________________
labnetwork mailing list
labnetwork at mtl.mit.edu<mailto:labnetwork at mtl.mit.edu>
https://www-mtl.mit.edu/mailman/listinfo.cgi/labnetwork<https://urldefense.proofpoint.com/v2/url?u=https-3A__www-2Dmtl.mit.edu_mailman_listinfo.cgi_labnetwork&d=DwMFaQ&c=WO-RGvefibhHBZq3fL85hQ&r=-H4Z_jeDfTYjnKPXor15vLwzBllmg8gFrb9m_k9OGks&m=cJHFZ3UBE6vSC9RsvTYCJ5Pj11cW_ts5rvt0enn30Ko&s=pHQh_adw1NwWE9UG1pNinX6o-ADwMIsAYGtiAcH8_78&e=>

-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://mtl.mit.edu/pipermail/labnetwork/attachments/20170906/4cd86109/attachment.html>