[labnetwork] Thermal uniformity measurement of RTA/RTP tools

[Jeff Salzmann]

Fred,

I’ve had success getting the uniformity characterized by growing a thin oxide on a bare Si wafer. I ran it flowing oxygen at 1100°C, no chlorine or anything else. Use a <111> wafer if possible, that’ll grow faster so you’ll get a thicker oxide for less process time.

I can’t recall if you can get lamp intensity control on the 610; that said, what I did was design an experiment around the bank intensities and grow oxides until the oxide uniformity was as good as I was able to set it. Using the Deal-Grove model, I was able to get ± 3°C thermal uniformity at 1100°C.

Good luck!!

Jeff

Jeff Salzmann
Design Engineer III, Research and Development
PCB Piezotronics
3425 Walden Avenue
Depew, NY 14043
O: 716.684.0002 x2907
C: 716.867.1302


From: labnetwork-bounces at mtl.mit.edu <labnetwork-bounces at mtl.mit.edu> On Behalf Of Fred Newman
Sent: Tuesday, February 18, 2020 4:35 PM
To: labnetwork at mtl.mit.edu
Subject: [labnetwork] Thermal uniformity measurement of RTA/RTP tools

  Hi All,

Does anyone have any experience with characterizing the thermal uniformity of RTA tools?  I am aware of using instrumented TC wafers, dry thermal oxide, Ti silicidation, and Al-Si eutectic to name a few, but am not so clear on all the advantages and disadvantages, particularly the true sensitivity vs. potential to be misled by results.  Any advice, anecdotes, or words of wisdom would be most appreciated.

For background, we have a couple of Heatpulse 610 units that we operate at the WNF using quartz holders for 100 - 150 mm wafers.  The holders we have make 3 asperity contact points with the wafer, so basically the configuration inside the tube is nominally nothing absorbing besides the wafer being annealed (usually Si) and the thermocouple wire tip (held by spring force against the wafer back), and little thermal interaction between the chamber fixture and the wafer.  Various users employ a broad range of temperatures, though the ones from whom I get the most questions about uniformity operate in the 500-600C range.

Many thanks!
Fred


--
Fred Newman
Research Engineer
University of Washington, Washington Nanofabrication Facility
4000 Mason Rd, Fluke Hall Room 115
Seattle WA 98195-2143
office 206-616-3534  mobile 505-450-4447
fnewman at uw.edu<mailto:fnewman at uw.edu>
https://www.wnf.washington.edu/
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